Latest News
July 27, 2021, New Taipei City, Taiwan - Lanner Electronics, a global leader in the design and manufacturing of intelligent edge computing appliances, announced today its partnership with Microsoft Azure to launch Edge-to-Cloud AI Solution, integrating Lanner AI accelerated intelligent edge appliance with Azure IoT edge module, runtime, cloud interface. Leveraging Azure IoT edge capability to execute the AI inference model, Lanner Edge AI appliances simplify AI deployments at the edge, reducing communications latency and increase workload efficiency.
Read more: Lanner Partners with Microsoft to Deliver Edge-to-Cloud AI Deployments
Lanner today announced the availability of platform support for Intel Programmable Services Engine (Intel PSE), starting from Q4, 2021.
At present, a 5G network is expected to connect to an unprecedented number of IoT devices, most of them streaming data-intensive applications in distributed and remote areas with limited connectivity. However, for 5G edge services in critical networks, users still expect high-bandwidth communications, agile network services and carrier-grade reliable connectivity.
Read more: Wireless SD-WAN - LTE Rugged uCPE for Delivering Low-Latency Services at Remote Sites
The rapid development of digital connectivity services is placing new demands on Mobile Network Operators (MNOs) to expeditiously grow capacity and increase scalability without worrying about increased energy consumption or rack space in order to seize new revenue opportunities. A compact, low-power edge solution will provide network operators a flexible and cost-effective route to highly advanced 10Gb/s Carrier Ethernet telecommunication services.
Read more: Whitebox 10G uCPE Platforms for Enterprise SD-WAN and SASE Deployment
Lanner has been dedicated to providing hundreds of successful computing deployment in intelligent transportation applications. Certified by SAE-J1455, Emark, EN50155, EN45545, and MIL-STD-810G for anti-vibration and shock, our customize computers are designed to provide mission-critical reliability and performance that meet the requirements of any in-vehicle and rolling stock applications.
June 18, 2021, New Taipei City, Taiwan - Lanner Electronics (TAIEX: 6245), a leading provider of SDN/NFV whitebox solutions, today announced its participation in the Telecom Infra Project (TIP). For the past few years, Lanner has actively participated in open networking organizations, such as Open Compute Project (OCP), Metro Ethernet Forum (MEF) and now Telecom Infra Project (TIP), to build open, scalable, hyper-converged white box platforms, empowering service providers to roll out SD-WAN, MEC, Open-RAN and 5G private network deployments.
Organizations today expect a great deal from their networking platforms, in terms of performance and bandwidth required, in addition to flexibility and responsiveness. At the center of this digital transformation is the Software-Defined Wide Area Network (SD-WAN) deployed on universal customer premises equipment (uCPE) that can bring virtualization services in the edge cloud.
Read more: 5G-Ready uCPE Solutions - Pre-validated Platforms for Agile Network Services at the Edge