View HardwareDownload PDF


Cloud-native Design

IEEE 1588 TimeSync

O-RAN Compliance

Secure BMC

vRAN Acceleration


Open RAN refers to a Radio Access Network (RAN) which is open, intelligent,and deployed on a virtualized platform with high flexibility. Open RAN isabout disaggregating hardware from software: open hardware and softwareusing standard processors with open interfaces.

Lanner collaborate with Radisys to create a high-performance,containerized-based 5G Open RAN solution with flexible deploymentoptions for various industries. The cost-effective, fully disaggregated OpenRAN solution includes Lanner’s Open RAN appliance and Radisys’ Open RANSoftware, delivering secure, real-time communication for enabling low-latency services for mission-critical applications.


Radisys RAN Software

Radisys Connect 5G software suite, based on a modular approach to Open RAN,expands the possibilities for building networks that deliver the high capacity,massive connectivity, and ultra-low latency required for 5G services.

5G NR Software Architecture
Highly interoperable to provide ease ofintegration with your existing and newnetwork ecosystem.

Supports both standalone (SA) and non-standalone (NSA) modes

FR-1 (sub-6 GHz) and FR-2 (mmWave)

Support split 7.2 (vRAN model)

All RAN software is available in bare-metalas well as containerized form factor (overnative Kubernetes as Docker pods)

Open northbound APIs over E2 and O1 O-RAN interfaces


Featured Products

DU/CU Server ECA-4027


DU/CU Server ECA-5540

ECA-4027   ECA-5540
  • Intel® Xeon D-2100 12/16 Cores Processor
  • Wide Operating Temperature -40~65ºC
  • 2x DDR4 2667 MHz REG, ECC RDIMM, Max. 128GB
  • Front Access I/O: 1x GbE RJ45 IPMI, 8x 10G SFP+, 2x 40G QSFP+, 1xRJ45 Console, 1x USB 3.0 and Front Fan Replacement
  • 2x 2.5” Internal HDD/SSD Bays, 2x M.2 NVMe 2280 M key
  • 1x PCI-E*16 FH/HL slot for vRAN accelerator
  • G.8272 T-GM Compliant IEEE 1588v2 SynE, onboard GPS
  • Intel® Sapphire Rapids EE Processor with I
  • ntel vRAN Boost
  • Short Depth Chassis and Front I/O Design
  • 16x DDR5 4400MHz RDIMM, Max. 1024GB
  • 1x OCP 3.0 NIC Module
  • 0 ~ 55ºC Operating Temperature
  • 2x M.2 NVMe 2280, 2x 2.5’’ SATA/ U.2
  • 1x FHFL PCIex 16 slot, 2xLP or 1xFHHL slot (PCIex8)
  • Secure BMC / TPM 2.0


Ready to Deploy?


Request a Demo