Open RAN Platforms

• Carrier-grade, full redundancy and extreme high performance
• 3rd Generation Intel® Xeon® Scalable Processor with AI Acceleration
• Support 5x 1U compute sleds or 2x 2U+1U compute sleds
• Support 2x 1U switch sleds for redundancy
• Support OCP NIC 3.0 Modules: 2U: Support FH3/4L double width PCIe Card, 1U: Support FHHL PCIe by 16 card
• 450mm Short Depth Chassis for Edge Deployment
• Distinguished, Flexible and Front I/O Access
• 1+1 Redundant Hot-swappable PSU
• NEBS-3 Compliant for Harsh Conditions

Available Blades

• Support 3rd Gen Intel Xeon Scalable Processor (codenamed Ice lake)
• Front Access I/O: Storage bays x4, PCIe x1, OCP NIC slot x1, mini-DP port (VGA signal), LOM and USB 3.0 ports
• Support FH3/4L double width or single width PCIe Card
• Support OCP NIC 3.0 Modules
• Compatible with HTCA-E400 Series

• Support 3rd Gen Intel Xeon Scalable Processor (codenamed Ice lake)
• Front Access I/O: Storage bays x2, PCIe x1, NIC slot x1, mini-DP port, LOM and USB 3.0 ports
• Support FHHL PCIe by 16 card
• Support OCP NIC 3.0 Modules
• Compatible with HTCA-E400 Series

• Fabric interface with 6x 100GbE QSFP28, 8x 10/25GbE SFP+
• Intel Tofino Series (BFN-T10-032D-B0) the maximum bandwidth up to 3.2 Tb/s.
• Compatible with HTCA-E400 Series

• NVIDIA Grace™ Hopper CPU Or Intel® Xeon®6 Processor
• 8x DDR5 6400MHz RDIMM, Max. 1536GB System Memory
• 2x Or 1x PCIe*16 FH 3/4L, 1x PCIe*16 FHHL Or 1x PCIe*16 LP(By SKU)
• 1x GbE RJ45, 1x RJ45 Console, 1x USB 3.0
• 2x M.2 NVMe (PCIe), 2x E1.S SSD
• 6x Smart Fans, 2x 1600W AC CRPS PSU

• 5th Gen Intel® Xeon® Scalable Processors
• 16x DDR5 RDIMM, Max. 1024 GB System Memory
• PCIe Slots: 2x FH3/4L, 2x LP
• 1x GbE RJ45,1x OCP3.0, 2x USB3.0
• 4x 2.5" HDD/SSD Drive Bays
• 1x M.2 NVMe (PCIe) 2242/2260 M Key, 1x M.2 (SATA) 2280 BB+M key
• 6x Smart Fans
• Intel QAT

• 5th/4th Gen Intel® Xeon® Scalable Processors
• Intel vRAN Boost Support (For 4th Gen Intel® Xeon® Scalable Processors Only)
• Short Depth Chassis and Front I/O Design
• 16x DDR5 4800MHz RDIMM, Max. 1024GB
• 1x OCP 3.0 NIC Module
• 0 ~ 50ºC Operating Temperature (By CPU SKU)
• 2x M.2 NVMe 2280, 2x 2.5" HDD/SSD Or 2x U.2
• 1x FHFL PCIex 16 slot, 2xLP or 1xFHHL slot (PCIex8)
• Secure BMC / TPM 2.0
• A NVIDIA-Certified System for industrial edge

• Intel® Xeon® D2700/2800 8~22 Cores
• 4x DDR4 3200/2933MHz REG RDIMM, Max. 256GB
• 8x 10G SFP+, 2x 25G SFP28, 2x GbE RJ45, 2x USB 3.0
• 1x RJ45 Console, 2x 2280 M.2 (1x NVMe & 1x SATA)
• -40C~65C Operating Temperature (SKU B/C/E)
• 1x OCP 3.0, 1x PCIe*16

• Intel® Xeon D-2100 12/16 Cores Processor
• Wide Operating Temperature -40~65ºC
• 2x DDR4 2667 MHz REG, ECC RDIMM, Max. 64GB
• Front Access I/O: 1x GbE RJ45 IPMI, 8x 10G SFP+, 2x 40G QSFP+, 1x RJ45 Console, 1x USB 3.0 and Front Fan Replacement
• 2x 2.5” Internal HDD/SSD Bays, 2x M.2 NVMe 2280 M key
• 1x PCI-E*16 FH/HL slot for FPGA or GPU cards
• Optional G.8272 T-GM Compliant IEEE 1588v2 SynE, onboard GPS

• Intel® Xeon D-2100 8/12/14/16 Cores Processor
• Short Depth Chassis and Wide Operating Temperature -40~65ºC
• 2x DDR4 2667 MHz REG, ECC RDIMM, Max. 64GB
• Front Access I/O with 1x GbE RJ45 for IPMI, 8x 10G SFP+, 1x RJ45 Console, 1x USB 3.0 and Screw-less Fan Replacement
• 4x 2.5” Internal HDD/SSD Bays, 1x M.2 NVMe 2280 M key
• 1x PCI-E x16 slot for FPGA or GPU cards (Max. up to 75W)
• Intel® QuickAssist Technology