DIN-Rail Industrial Gateway
- Intel® Atom E3825 CPU
- 4x RJ45, 2x USB
- 4/6/8/10x COM by SKU
Wide Temperature DIN Rail Box PC with 4G LTE Connectivity Support
- Wide operating temperature range (-40~70°C)
- Intel® Atom™ E3825 SoC CPU
- Front access I/O ports: LEC-3031-A4/6/8: 4/6/8 x RS-232/422/485, LEC-3031-I4/10: 4 or 10 x isolated COM ports
- 2 or 4 x Isolated GbE LAN / 4 x USB:1x USB 3.0, 1x or 3x USB 2.0, VGA port
- 1 x M.2 3042 (USB2.0 signal) for 4G LTE Wireless Expansion
- Fanless and compact design
DIN-Rail Industrial Gateway
- Intel Celeron N2807 CPU
- 2x RJ45, 2x USB
- 4x DI/O
Compact Industrial Grade DIN Rail Box PC with Intel® N2807/E3815 Processor
- Compact-sized industrial grade box PC
- Dual-core Intel Celeron N2807 SoC CPU or Single-core Atom E3815
- ESD/surge protection on serial COM ports for harsh environments
- Wide operating temperature (LEC-3030T:-40~70°C)
- Fanless design with corrugated aluminum
- Support VGA display output
- DIN-Rail or wall mounting options
- Support 4x DI/O
- Dual GbE LAN ports, 1 x USB 2.0, 1 x USB 3.0 port
- 1 x SATA port
Intelligent Video Platform
- Intel® Core™ i7/i5/i3
- 6x RJ45, 6x USB
- 2x Mini-PCIe
High-performance IPC with Intel® 6th Gen Skylake Core™ i7/i5/i3 CPU
- Intel® Core™ i7-6600U/i5-6300U/i3-6100U
- Intel® HD Graphics
- 2x HDMI, 3840 x 2160@24Hz or 2560 x 1600@60Hz
- 6x RJ45 (LEC-2580) or 2x RJ45 & 4x PoE (LEC-2580P)
- 4x USB 3.0, 2x USB 2.0
- 2x 2.5” HDD/SSD with RAID 0/1, 4x Serial Ports
- Operating Temperatures: 0°C~60°C (LEC-2580), 0°C~50°C (LEC-2580P)
Embedded Platform
- Intel® Celeron® J1900
- 2x RJ45, 5x USB
- 1x Mini-PCIe
Compact High-performance IPC Powered by the Intel® Bay Trail CPU
- Intel® Celeron® J1900 processor
- Fanless design
- 2 Giga LAN ports
- 2 serial COM ports
- 5 USB ports
- Mini-PCIe, PCI and PCI-E riser cards
- 9VDC to 30VDC power input
AI Starter Kits
- Intel® Core i7-8700
- Falcon-H8 AI Card
- LAN, PoE, COM, DI/DO
NEW
Intelligent Edge Appliance With Falcon-H8 PCIe AI Accelerator Card
- Intel® Core i7-8700
- Falcon-H8 AI Accelerator Card With 6x Hailo-8™ AI Processors
- 2x DDR4 2133/2400 SO-DIMM, Max. 32GB
- 2x RJ45 GbE LAN, 4x PoE, 4x USB3.0, 6x COM Ports, 8x DI & 8x DO
- 2x Removable HDD/SSD External Slot w/ RAID, 1x mSATA
- 1x PCIe*16, 1x PCIe*4, 1x Mini-PCIe (PCIe + USB2.0) w/ Nano-SIM, 1x B Key M.2 (PCIe + USB3.0) w/ Nano-SIM
Deep Learning Inference Appliances
- Intel® Core™ i7-8700
- 4xPoE, 4xUSB, 6xCOM
- NVIDIA® A2 GPU Support
NEW
Nvidia NGC-ready Edge AI Appliance With NVIDIA® A2 GPU Compatibility
- Intel® Core™ i7-8700
- NVIDIA® A2 GPU Card Support
- 2x DDR4 2133/2400 SO-DIMM, Max. 32GB
- 2x RJ45 GbE LAN, 4x PoE, 4x USB3.0, 6x COM Ports, 8x DI & 8x DO
- 2x Removable HDD/SSD External Slot w/ RAID, 1x mSATA
- Built-in TPM 2.0 & Optional IPMI Support
- A NVIDIA-Certified System for Industrial edge
Deep Learning Inference Appliances
- Intel® Core™ i7-8700
- 4xPoE, 4xUSB, 6xCOM
- Intel® Movidius™ Myriad
NEW
Edge AI Appliance With Intel® Core™ i7-8700, Myriad X VPU & OpenVINO
- Intel® Core™ i7-8700
- Support Intel® Movidius™ Myriad™ X mPCIe card
- 2x DDR4 2133/2400 SO-DIMM, Max. 32GB
- 2x RJ45 GbE LAN, 4x PoE, 4x USB3.0, 6x COM Ports, 8x DI & 8x DO
- 2x Removable HDD/SSD External Slot w/ RAID, 1x mSATA
- Built-in TPM 2.0 & IPMI Support
Embedded Platform
- 8th Gen. Intel Core™ i7
- 2x RJ45, 4x USB
- 1x Mini-PCIe
NEW
Intelligent Edge Computing Box PC w/ Support for Intel® Core™ i7-8700T/i7-8700 and Intel® Xeon® E-2278GEL
- Intel® Core™ i7-8700T/i7-8700 & Intel® Xeon® E-2278GEL
- 2x DDR4 2133/2400 SO-DIMM, Max. 64GB
- 2x RJ45 GbE LAN, 4x PoE, 4x USB3.0, 6x COM Ports, 8x DI & 8x DO
- 2x Removable HDD/SSD External Slot w/ RAID, 1x mSATA
- 1x PCIe*16, 1x PCIe*4, 1x Mini-PCIe w/ Nano-SIM, 1x B Key M.2 w/ Nano-SIM
Embedded Platform
- Intel® Core™ i7/i5/i3
- 2x RJ45, 6x USB
- 2x Mini-PCIe
4th Gen Intel® Core™ i7/i5/i3 Platform with Rich I/O and Expansion
- Intel® Core™ i7/i5/i3 CPU with QM87 PCH
- Intel® HD Graphics 4600
- HDMI/VGA/DVI-D & 3 Independent Display Ports
- 2x USB 3.0 Ports & 4x USB 2.0 Ports
- Mini-PCI-E Slots / 2x PCI or 2x PCI-E x8
- 2x 2.5” HDD/SSD Removable Trays with RAID 0/1
Embedded Platform
- Intel® Core™ i7/i5/i3
- 2x RJ45, 6x USB
- 1x Mini-PCIe
4th Gen Intel® Core™ i7/i5/i3 Platform with Rich I/O and Expansion
- Intel® Core™ i7/i5/i3 CPU with QM87 PCH
- Intel® HD Graphics 4600
- HDMI/VGA/DVI-D & 3 Independent Display Ports
- 2x USB 3.0 Ports & 4x USB 2.0 Ports
- Mini-PCI-E Slots / 1x PCI or 1x PCI-E x16
- 2x 2.5” HDD/SSD Bays with RAID 0/1
Embedded Platform
- Intel® Core™ i7/i5/i3
- 2x RJ45, 6x USB
- 2x Mini-PCIe
Fanless Embedded Computer with 3rd Gen Intel Core i7/i5/i3
- Intel® Core™ i7-3612QE/i7-3555LE/i5-3610ME/i3-3120ME
- Expandable PCI or PCIe slot
- Fanless design with corrugated aluminum
- Multiple display output (HDMI, VGA and DVI-D)
- Wide voltage input range (9~30VDC)
- Easily-opened chassis, no tools required
- Various mounting options
- Integrated SIM card reader
- Multi I/O expansion layer
- Remote power control
Intelligent Video Platform
- Intel Celeron N3350
- 6x RJ45, 4x USB
- 1x Mini-PCIe
Optimized IoT-ready Solution for Machine Vision and Physical Security
- Intel® Celeron® N3350 or Atom™ x7-E3950
- 6x Ethernet Ports (LEC-2137A/LEC-2137C)
- 2x Ethernet Ports & 4x PoE Ports (LEC-2137B/LEC-2137D)
- 2x USB 3.0, 2x USB 2.0, 1x RS-232/422/485 DB9 Male
- -20°C~55°C Operating Temperatures (LEC-2137A/LEC-2137B)
- 1x HDMI (3840 x 2160), 1x VGA (1600 x 1200)
vCPE/uCPE Platforms
- Intel® Atom™ x6000E
- 2x RJ45, 2x HDMI
- 3x Optional 4G LTE
NEW
Rugged In-vehicle Gateway with Multi-WAN Connectivity
- Intel® Atom™ x6000E Processor (codenamed: Elkhart Lake)
- 1x DDR4 3200MT/s With SODIMM slot up to 32GB
- eMMC default 64GB, 1x SATA
- 3x PGN Series Removable Caddy, 1x M.2 3042 B key socket with dual nano-SIM slot for 4G LTE, 1x M.2 2230 E key socket for Wi-Fi
- 2x GbE Ethernet, 3x USB 2.0, 1x USB 3.0, 2x HDMI with screw lock, 2x RS232/422/485, 1x CAN 2.0/ J1939/J1708, 4x DIO isolation, TPM
- Operating temperature: -40~70ºC
- 2x HDMI
- GPS+GLONASS dual band, G-sensor
- CE/FCC Class A, E13, MIL-STD-810G anti-vibration & shock
Wide Temperature Network Appliances
- Intel Atom Denverton
- 5G & Wi-Fi 6 Ready
- IP67 & Wide Temp.
NEW
IP67 Rugged 5G Edge Network Appliance
- Fanless Design Compliant with IP67 and MIL-STD-810G
- Intel® Atom® C3000 Extended Temperature CPU (Denverton)
- 2x DDR4 up to 2133 MHz ECC SODIMM Slots, Default 16GB x1
- M12 I/O: SR-IOV for 4x LAN, 2x PoE+(By SKU), 1x USB, 1x Console
- Wide Operating Temperature: -40~70ºC or -40~60ºC (By SKU)
- 1x M.2 Socket for 5G, 1x M.2 socket for Wi-Fi 6, 1x Mini-SIM
- Intel® QuickAssist Technology
- On-board eMMC 128GB, 1x M.2 2242 B Key, TPM 2.0
Intelligent Video Platform
- 11th Gen Intel® Core i
- PoE+, COM Ports
- Nano SIM (5G), M.2 (WiFi)
NEW
Computing Vision IPC With 11th Gen Intel® Core i Series CPU
- 11th Gen Intel® Core i CPU (Up to i7-1185GRE)
- 2x DDR4 3200 IBECC SO-DIMM, Max. 64GB
- 4x PoE+, 2x Ethernet Ports, 4x COM Ports, 4x USB 3.0
- Intel® Iris® Xe Graphics, 2x HDMI, 4x DI & 4x DO
- 1x M.2 B-Key w/ Nano SIM For 5G, 1x M.2 E-Key For WiFi, 1x mSATA
Deep Learning Inference Appliances
- 11th Gen Intel® Core i CPU
- 1x M.2 B+M Key Hailo-8™
- PoE+, RJ45, COM, DIO
NEW
Computing Vision IPC w/ 11th Gen Intel® Core i Series CPU & Pre-installed M.2 B+M Key Hailo-8™ AI Accelerator
- 11th Gen Intel® CoreTM i CPU (Up to i7-1185GRE)
- Pre-installed 1x M.2 B+M Key Hailo-8™ AI Accelerator
- 2x DDR4 2133/2400 SO-DIMM, Max. 64GB
- 6x PoE+, 2x Ethernet Ports, 2x COM Ports, 4x USB 3.0
- Intel® Iris® Xe Graphics, 2x HDMI, 8x DI & 4x DO
- 1x M.2 B-Key w/ Nano SIM For 5G, 1x M.2 E-Key For WiFi-6
- 1x M.2 M-Key For PCIe Gen4 x4 NVMe SSD
Intelligent Video Platform
- 11th Gen Intel® Core i CPU
- 6x PoE+, 2x RJ45, 2x COM
- 2x HDMI, 8x DI, 4x DO
NEW
Computing Vision IPC w/ 11th Gen Intel® CoreTM i Series CPU (Codenamed Tiger Lake-UP3)
- 11th Gen Intel® Core i CPU (Up to i7-1185GRE)
- 2x DDR4 2133/2400 SO-DIMM, Max. 64GB
- 6x PoE+, 2x 2.5 Gbps RJ45, 2x COM Ports, 4x USB 3.0
- Intel® Iris® Xe Graphics, 2x HDMI, 8x DI & 4x DO
- 1x M.2 B-Key w/ Nano SIM For 5G, 1x M.2 E-Key For WiFi-6
- 1x M.2 M-Key For PCIe Gen4 x4 NVMe SSD
DIN-Rail Industrial Gateway
- Intel® Atom™ X7-E3950
- Front access I/O ports
- 2x CAN, 1x DP, 2x M.2
NEW
Robust DIN-rail Fanless Industrial Gateway with LTE/Wi-Fi 6 Connectivity Support
- Intel® Atom™ X7-E3950 / N3350 SoC CPU (formerly Apollo Lake)
- Front access I/O ports: 2x COM, 2x CAN 2.0(optional for 2x COM), 4x DI/DO, 2x USB 3.0, 1x DB9 console, DP, SKU A/M/O: 4x GbE RJ45 (one pair Bypass), SKU B/N/P: 2x GbE RJ45 (one pair Bypass) & 2x SFP
- Onboard eMMC 64GB, 1x mSATA, optional 1x internal SATA 2.5”drive bay, TPM 2.0
- 1x M.2 B-Key w/ Nano SIM For LTE, 1x M.2 E-Key For Wi-Fi 5/6
- Wide operating temperature range: -40~70°C for industrial SKU A/B
Embedded Platform
- Intel® Apollo Lake
- 3x LAN, 2x COM
- 2x DP, 4x DIO
NEW
Industrial Environment Gateway IPC With Intel® Apollo Lake CPU
- Intel® Apollo Lake CPU
- 3x or 2x GbE LAN, 2x RS232/422/485 COM
- 2x USB 3.0 & 2x USB 2.0, 2x Display Ports, 4x DIO
- 1x M.2 3042 B Key For LTE w/ Dual SIM, 1x M.2 2230 E Key For WiFi
- 1x mSATA, 1x 2.5” SATA Drive Bay (Optional)
- 1x DDR3L SODIMM, Max. 8GB
Vehicle/Rail Computer
- Intel Atom x7-E3950
- M-12 LAN and HDMI ports
- 2x M.2, 4x SIM slots
NEW
Fanless Rolling Stock Computer with Intel® Atom™ x7-E3950 Processor
- Intel® Atom™ x7-E3950 Processor
- Certified with EN50155, EN50121, EN50125 and EN45545
- Vehicle/Rail Computer with 6x M12 GbE ports
- 2x M.2 Slots with up to 4x SIM card readers
- Wide range operating temperature from -40 to 70°C
- 2x HDMI and 4x USB ports
- 1x Internal HDD/SSD drive bay
- Support 24~36V or 72~110V power input
DIN-Rail Industrial Gateway
- AMD Ryzen V1404I CPU
- 6x or 4x GbE RJ45 + 2x SFP
- Optional LTE support
NEW
IEC 61850-3 Wide Temperature Industrial Cybersecurity Gateway
- Comply with IEC 61850-3 and IEEE 1613
- AMD Ryzen V1404I CPU
- 6x GbE RJ45 or 4x GbE RJ45 + 2x GbE SFP
- RJ45 LAN Support One Pair LAN Bypass
- Front-access I/O: RJ45 Console, USB 3.0 and 2x DIO ports
- Optional LTE Module Support
- Dual +12~48Vdc Power Input
- Wide Operating Temperature -40~70ºC
DIN-Rail Industrial Gateway
- Intel® Atom™ X6000E CPU
- 6x 2.5 GbE RJ45 + 2x SFP
- Optional LTE/Wi-Fi/5G-sub6
NEW
IEC 61850-3 Wide Temperature Industrial Cybersecurity Gateway
- IEC 61850-3 and IEEE 1613 Certified
- Intel® Atom™ X6211E/X6413E/X6425E CPU (formerly Elkhart Lake)
- 6x 100M/1G/2.5 GbE RJ45 with 1 pair bypass, 2x GbE SFP, TPM 2.0, 1x COM, 2x USB, 2x DIO
- Chassis Intrusion Detect, Optional Wi-Fi 6E & IPMI support
- 1x M.2 B-Key w/ dual-Nano SIM For LTE/5G-sub6, 1x M.2 E-Key for Wi-Fi module (By SKU)
- Dual +12~48Vdc Power Input, Operating Temperature -40~70ºC
DIN-Rail Industrial Gateway
- Intel® Atom™ E3900
- Front access RJ45, SFP, DIO
- 2x SIM, 1x DP, 2x M.2
NEW
Industrial-Grade Cyber Security Appliance with Intel® Atom™ E3900 Processor
- Industrial-Grade Cyber Security Platform
- Intel® Atom™ x7-E3950 / x5-E3940 (Apollo Lake)
- 8x, 6x or 4x GbE RJ45 ports with 1 or 2 pairs Bypass, SKU C,D,F with 2x GbE SFP
- Onboard TPM 2.0
- 2x USB 3.0, 1x DB9 console, 2x DIO, 64GB eMMC onboard
- M.2 B-Key for LTE/5G sub6 with dual SIM, M.2 E-Key for WiFi
Modules and Acceleration Cards
- IPMI 2.0 Compliant
- OPMA Interface