Open RAN Platforms
- 4U Edge Server
- Intel ICE Lake CPU
- Short Depth Chassis
NEW
Carrier-grade Edge Server Chassis for Open RAN / MEC
- Carrier-grade, full redundancy and extreme high performance
- 3rd Generation Intel® Xeon® Scalable Processor with AI Acceleration
- Support 5x 1U compute sleds or 2x 2U+1U compute sleds
- Support 2x 1U switch sleds for redundancy
- Support OCP NIC 3.0 Modules: 2U: Support FH3/4L double width PCIe Card, 1U: Support FHHL PCIe by 16 card
- 450mm Short Depth Chassis for Edge Deployment
- Distinguished, Flexible and Front I/O Access
- 1+1 Redundant Hot-swappable PSU
- NEBS-3 Compliant for Harsh Conditions
Open RAN Platforms
- Intel Ice Lake CPU
- Double-Width FH3/4L PCIe
- Support OCP NIC 3.0
NEW
2U Compute Sled for HTCA-E400
- Support 3rd Gen Intel Xeon Scalable Processor (codenamed Ice lake)
- Front Access I/O: Storage bays x4, PCIe x1, OCP NIC slot x1, mini-DP port (VGA signal), LOM and USB 3.0 ports
- Support FH3/4L double width or single width PCIe Card
- Support OCP NIC 3.0 Modules
- Compatible with HTCA-E400 Series
Open RAN Platforms
- Intel Ice Lake CPU
- 1x PCIe slot
- Support OCP NIC 3.0
NEW
Open RAN Platforms
- 10/25/100GbE fiber
- Intel Tofino Switch
- Optional IEEE 1588
NEW
Open RAN Platforms
- Intel® Sapphire Rappids EE
- OCP 3.0 NIC Module
- 2x PCIe Slots
PRELIMINARY
5G Edge Server with Intel® Xeon®Scalable Processor (Sapphire Rapids SP/EE)
- Intel® Sapphire Rapids SP/EE Processor
- Intel vRAN Boost Support (Sapphire Rapids EE)
- Short Depth Chassis and Front I/O Design
- 16x DDR5 4400MHz RDIMM, Max. 1024GB
- 1x OCP 3.0 NIC Module
- 0 ~ 55ºC Operating Temperature
- 2x M.2 NVMe 2280, 2x 2.5’’ SATA/ U.2
- 1x FHFL PCIex 16 slot, 2xLP or 1xFHHL slot (PCIex8)
- Secure BMC / TPM 2.0
Open RAN Platforms
- Intel® Xeon D-2100
- Short Depth Chassis
- Wide Temperature
NEW
Short Depth Chassis Edge Computing Appliance with Intel Xeon® D-2100 Multi-core Processor (Codenamed Skylake-DE)
- Intel® Xeon D-2100 12/16 Cores Processor
- Wide Operating Temperature -40~65ºC
- 2x DDR4 2667 MHz REG, ECC RDIMM, Max. 64GB
- Front Access I/O: 1x GbE RJ45 IPMI, 8x 10G SFP+, 2x 40G QSFP+, 1x RJ45 Console, 1x USB 3.0 and Front Fan Replacement
- 2x 2.5” Internal HDD/SSD Bays, 2x M.2 NVMe 2280 M key
- 1x PCI-E*16 FH/HL slot for FPGA or GPU cards
- Optional G.8272 T-GM Compliant IEEE 1588v2 SynE, onboard GPS
Open RAN Platforms
- Intel® Xeon D-2100
- Short Depth Chassis
- Wide Temperature
NEW
1U 19” Rackmount Open RAN Appliance with Intel Xeon® D-2100 Multi-core Processor (Codenamed Skylake-DE)
- Intel® Xeon D-2100 8/12/14/16 Cores Processor
- Short Depth Chassis and Wide Operating Temperature -40~65ºC
- 2x DDR4 2667 MHz REG, ECC RDIMM, Max. 64GB
- Front Access I/O with 1x GbE RJ45 for IPMI, 8x 10G SFP+, 1x RJ45 Console, 1x USB 3.0 and Screw-less Fan Replacement
- 4x 2.5” Internal HDD/SSD Bays, 1x M.2 NVMe 2280 M key
- 1x PCI-E x16 slot for FPGA or GPU cards (Max. up to 75W)
- Intel® QuickAssist Technology