Embedded Platform
- Intel® Core™ i7/i5/i3
- 2x RJ45, 6x USB
- 2x Mini-PCIe
Fanless Embedded Computer with 3rd Gen Intel Core i7/i5/i3
- Intel® Core™ i7-3612QE/i7-3555LE/i5-3610ME/i3-3120ME
- Expandable PCI or PCIe slot
- Fanless design with corrugated aluminum
- Multiple display output (HDMI, VGA and DVI-D)
- Wide voltage input range (9~30VDC)
- Easily-opened chassis, no tools required
- Various mounting options
- Integrated SIM card reader
- Multi I/O expansion layer
- Remote power control
Intelligent Video Platform
- Intel Celeron N3350
- 6x RJ45, 4x USB
- 1x Mini-PCIe
Optimized IoT-ready Solution for Machine Vision and Physical Security
- Intel® Celeron® N3350 or Atom™ x7-E3950
- 6x Ethernet Ports (LEC-2137A/LEC-2137C)
- 2x Ethernet Ports & 4x PoE Ports (LEC-2137B/LEC-2137D)
- 2x USB 3.0, 2x USB 2.0, 1x RS-232/422/485 DB9 Male
- -20°C~55°C Operating Temperatures (LEC-2137A/LEC-2137B)
- 1x HDMI (3840 x 2160), 1x VGA (1600 x 1200)
vCPE/uCPE Platforms
- Intel® Atom™ x6000E
- 2x RJ45, 2x HDMI
- 3x Optional 4G LTE
NEW
Rugged In-vehicle Gateway with Multi-WAN Connectivity
- Intel® Atom™ x6000E Processor (codenamed: Elkhart Lake)
- 1x DDR4 3200MT/s With SODIMM slot up to 32GB
- eMMC default 64GB, 1x SATA
- 3x PGN Series Removable Caddy, 1x M.2 3042 B key socket with dual nano-SIM slot for 4G LTE, 1x M.2 2230 E key socket for Wi-Fi
- 2x GbE Ethernet, 3x USB 2.0, 1x USB 3.0, 2x HDMI with screw lock, 2x RS232/422/485, 1x CAN 2.0/ J1939/J1708, 4x DIO isolation, TPM
- Operating temperature: -40~70ºC
- 2x HDMI
- GPS+GLONASS dual band, G-sensor
- CE/FCC Class A, E13, MIL-STD-810G anti-vibration & shock
Wide Temperature Network Appliances
- Intel Atom Denverton
- 5G & Wi-Fi 6 Ready
- IP67 & Wide Temp.
NEW
IP67 Rugged 5G Edge Network Appliance
- Fanless Design Compliant with IP67 and MIL-STD-810G
- Intel® Atom® C3000 Extended Temperature CPU (Denverton)
- 2x DDR4 up to 2133 MHz ECC SODIMM Slots, Default 16GB x1
- M12 I/O: SR-IOV for 4x LAN, 2x PoE+, 1x USB, 1x Console
- Wide Operating Temperature: -40~70ºC (SKU D & F)
- 1x M.2 Socket for 5G, 1x M.2 socket for Wi-Fi 6, 1x Mini-SIM
- Intel® QuickAssist Technology
- On-board eMMC 64GB, 1x M.2 2242 B Key, TPM 2.0
Intelligent Video Platform
- 11th Gen Intel® Core i CPU
- 6x PoE+, 2x RJ45, 2x COM
- 2x HDMI, 8x DI, 4x DO
NEW
Computing Vision IPC w/ 11th Gen Intel® CoreTM i Series CPU (Codenamed Tiger Lake-UP3)
- 11th Gen Intel® Core i CPU (Up to i7-1185GRE)
- 2x DDR4 2133/2400 SO-DIMM, Max. 64GB
- 6x PoE+, 2x Ethernet Ports, 2x COM Ports, 4x USB 3.0
- Intel® Iris® Xe Graphics, 2x HDMI, 8x DI & 4x DO
- 1x M.2 B-Key w/ Nano SIM For 5G, 1x M.2 E-Key For WiFi-6
- 1x M.2 M-Key For PCIe Gen4 x4 NVMe SSD
Vehicle/Rail Computer
- Intel Atom x7-E3950
- M-12 LAN and HDMI ports
- 2x M.2, 4x SIM slots
NEW
Fanless Rolling Stock Computer with Intel® Atom™ x7-E3950 Processor
- Intel® Atom™ x7-E3950 Processor
- Certified with EN50155, EN50121, EN50125 and EN45545
- Vehicle/Rail Computer with 6x M12 GbE ports
- 2x M.2 Slots with up to 4x SIM card readers
- Wide range operating temperature from -40 to 70°C
- 2x HDMI and 4x USB ports
- 1x Internal HDD/SSD drive bay
- Support 24~36V or 72~110V power input
Modules and Acceleration Cards
- IPMI 2.0 Compliant
- OPMA Interface
IPMI (Intelligent Platform Management Interface) Card with GbE management port
- OPMA Interface and IPMI 2.0 Compliant
- Centralized Management and Remote Configuration
- Branding Service
Open RAN Platforms
- 4U Edge Server
- Intel ICE Lake CPU
- Short Depth Chassis
PRELIMINARY
PRELIMINARY
Carrier-grade Edge Server Chassis for Open RAN / MEC- Carrier-grade, full redundancy and extreme high performance
- 3rd Generation Intel® Xeon® Scalable Processor with AI Acceleration
- Support 5x 1U compute sleds or 2x 2U+1U compute sleds
- Support 2x 1U switch sleds for redundancy
- Support OCP NIC 3.0 Modules: 2U: Support FH3/4L double width PCIe Card, 1U: Support FHHL PCIe by 16 card
- 450mm Short Depth Chassis for Edge Deployment
- Distinguished, Flexible and Front I/O Access
- 1+1 Redundant Hot-swappable PSU
- NEBS-3 Compliant for Harsh Conditions
HybridTCA Platforms
- 12x Cascade Lake CPU
- 2x Switch, 4x Ether Blade
- NEBS compliant design
High Availability Chassis 6U Telecom Network Appliance with 6 x86 CPU Blades and 6 I/O Blades
- High availability, full redundancy and extreme high performance
- 6 CPU blades in the rear, per blade supports up to 2 Intel® Xeon® Processor Scalable Family CPUs and 16x DDR4 R-DIMM
- 6 x Swappable I/O blades on the front, supporting up to 2x Switch blades or 6x Ethernet blades; 6x swappable 3.5” HDD bays
- Blade 1~2: Switch fabric blade or Blade 1~6: Ethernet I/O blade
- NEBS compliant design
- Redundant power supply and removable fan module
HybridTCA Platforms
- 8x Scalable Xeon CPUs
- 2x Switch, 1x Storage Blade
- NEBS compliant design
NEW
High Availability Chassis 4U Telecom Network Appliance with 4 x86 CPU Blades and 2x Switch blades for redundancy, Storage blades with 10x NVMe SSD or Network blades
- High availability, full redundancy and extreme high performance
- 4 compute blades in the rear, per blade supports up to dual Intel® Xeon® Scalable (Skylake-SP) CPUs and 16x DDR4 R-DIMM
- Upper 2 slots: 2x switch blades in upper two slots for redundancy or 2x Ethernet blades
- Bottom 2 slots: Storage blades with 10x NVMe SSD in bottom two slots or up to 2x Ethernet blades
- Max. up to 80 ports 10G SFP+ Ethernet ports (4x Ethernet blades)
- N+N Redundant power supply and removable fan module
- NEBS compliant design
HybridTCA Platforms
- Max. 4x Broadwell-EP CPUs
- 2x Switch/Ethernet Blade
- NEBS compliant design
High Availability Chassis 2U Telecom Network Appliance with 2 x86 CPU Blades and 2 I/O Blades
- High availability, full redundancy and extreme high performance
- 2 CPU blades in the rear, per blade supports up to 2 Intel® Xeon® Processor Scalable Family CPUs and 16x DDR4 R-DIMM
- Blade 1~2: Switch fabric blade or ethernet I/O blade
- 2 x Swappable I/O blades in front, supporting up to 2 switch blades or Ethernet blade configuration
- Redundant power supply and removable fan module
- NEBS compliant design
Open RAN Platforms
- Intel Ice Lake CPU
- Double-Width FH3/4L PCIe
- Support OCP NIC 3.0
PRELIMINARY
PRELIMINARY
2U Compute Sled for HTCA-E400- Support 3rd Gen Intel Xeon Scalable Processor (codenamed Ice lake)
- Front Access I/O: Storage bays x4, PCIe x1, OCP NIC slot x1, mini-DP port (VGA signal), LOM and USB 3.0 ports
- Support FH3/4L double width or single width PCIe Card
- Support OCP NIC 3.0 Modules
- Compatible with HTCA-E400 Series
Open RAN Platforms
- Intel Ice Lake CPU
- 1x PCIe slot
- Support OCP NIC 3.0
PRELIMINARY
PRELIMINARY
1U Compute Sled for HTCA-E400- Support 3rd Gen Intel Xeon Scalable Processor (codenamed Ice lake)
- Front Access I/O: Storage bays x2, PCIe x1, NIC slot x1, mini-DP port, LOM and USB 3.0 ports
- Support FHHL PCIe by 16 card
- Support OCP NIC 3.0 Modules
- Compatible with HTCA-E400 Series
Modules and Blades
- 2x Intel Xeon Cascade Lake
- Max. 512GB Memory
- 5x Hot Swappable Fans
Compute Blade for HTCA-6000 Series Powered by 2nd Generation Intel® Xeon® Scalable Processors
- Hot swappable x86 compute blade
- Support dual 2nd Generation Intel® Xeon® Scalable Processors (codenamed Skylake-SP/Cascade Lake) C621/C627 PCH
- 16x 288-pin DDR4 DIMMs, max. up to 512GB memory capacity
- 4x KR4 supporting 4x 100G to front Switch blades
- 5x Hot swappable smart fans
Modules and Blades
- Intel Atom E3800
- Max. 8GB Memory
- HLM1020 Compatible
x86 Control Board for HLM-1020
- Intel Atom SoC Processor E3800 Product Family
- DDR3 SODIMM Socket up to 8GB DDR3L Non-ECC Memory
- Use SAMTEC connector to connect HLM-1020
Open RAN Platforms
- 10/25/100GbE fiber
- Intel Tofino Switch
- Optional IEEE 1588
PRELIMINARY
PRELIMINARY
10/25/100 GbE Switch Sled with Intel Tofino Series- Fabric interface with 6x 100GbE QSFP28, 8x 10/25GbE SFP+
- Intel Tofino Series (BFN-T10-032D-B0) the maximum bandwidth up to 3.2 Tb/s.
- Compatible with HTCA-E400 Series
Modules and Blades
- 14x QSFP28 Ports
- Intel Tofino Switch
- For HTCA-6600 Series
NEW
100 GbE Switch Blade with Intel Tofino P4-programmable with Control Board
- Fabric interface switch blade with 14x 100GbE QSFP28
- Intel Tofino T10-032D 3.2Tbps bandwidth Multilayer Switch
- P4 programmable
- Compatible with HTCA-6600 Series
Modules and Blades
- 2xQSFP28+16xSFP+4xRJ45
- Broadcom Trident-III
- For HTCA-6000 Series
HybridTCA Switch Blade with BCM56770 Switching Controller and 2 x 100GbE QSFP + 16 x 10/25GbE SFP28 + 4 x 10GbE RJ45
- 2 x 100GbE QSFP28 + 16 x 10/25GbE SFP28 + 4 x 10GbE RJ45Switch Blade
- Broadcom StrataXGS Trident-III BCM 56770 switch controller
- Compatible with HTCA-6000 Series
Modules and Blades
- 20x 10GbE SFP+
- Intel XL710 Controller
- For HTCA-6000 Series
20-port 10GbE SFP+ Ethernet Network Interface Blade with Intel XL710 Ethernet Controller
- Intel XL710 Ethernet Controller
- 20-port 10GbE SFP+ cage
- Compatible with HTCA 6000 Series
Modules and Blades
- 6x100G/4x40G/6x10G SFP
- Broadcom Tomahawk
- For HTCA-6000 Series
100 GbE Switch Blade with Broadcom StrataXGS Tomahawk BCM56960
- Fabric interface switch blade with 6x 100GbE QSFP28, 4x 40GbE QSFP+ and 16x 10GbE SFP+
- Broadcom StrataXGS Tomahawk BCM56960 3.2Tbps bandwidth Multilayer Switch
- Compatible with HTCA-6000 Series
Hyper-Converged Appliances
- 2x Intel Xeon Cascade Lake
- 12x 3.5” Drive Bays
- Max. 768GB Memory
NEW
2U High Performance x86 Hyper-converged appliance with 12 x 3.5” Storage Bays
- 2U High Performance Hyper-converged Appliance
- Support Dual 2nd Gen Intel® Xeon® Scalable SP processor family up to 205w and max. up to 24x DDR4 R-DIMM
- Front: 12 x 3.5”HDD SATA 6G (Default) , SAS/2 NVME (Optional)
- Rear: 2 x 2.5” SATA 6G
- Console, LOM port, MGT port, 2x USB 3.0 ports, RJ45, SFP+ ports
- 2x PCI-E*16 FH 10.5”L (Max. 266.7mm) + 1x PCI-E *8 HH/HL
- 1+1 redundant power supply
x86 Rackmount Network Appliances
- Intel Xeon Cascade Lake
- 10x DDR4 320GB Max
- 4x 3.5" HDD, 4x NIC
NEW
2U Rackmount Storage Gateway Appliance for Enterprise and Telecom
- 2nd Gen Intel® Xeon® Processor Scalable Family with Intel® C621/C627 Chipset
- 4x 3.5” Swappable HDD, 1x mSATA Onboard Slot
- 10x 288pin, DDR4 2666 MHz REG DIMM, Max. 320GB
- 4x 10G SFP+ or 4x GbE RJ45 (By SKU), 4x NIC Module Slots
- 2x Consoles (RJ45 and Mini USB), 2x USB 3.0
- Intel® QuickAssist Technology (By SKU)
x86 Rackmount Network Appliances
- Intel Atom Rangeley
- 2x DDR3 16GB Max
- 6x RJ45, 1x NIC
Rackmount x86 Network Security Platform with 8-core Intel® Atom® C2000 Series processor
- Intel 8-core Atom C2000 SoC CPU (codenamed "Rangeley")
- Optional rear PCIe expansion slot
- High port density for a 1U rackmount, with a maximum of 14 Gigabit Ethernet ports
- Supports QuickAssist Crypto Acceleration
- Supports up to 16 GB ECC DDR3 Memory
- Intel i210AT LAN controller
- 1 system cooling fan
- Supports 3rd Generation LAN Bypass function
- Built-in LCM with keypad
- 1 x PCIe 3rd Generation NIC expansion slot for various types of NIC modules (1G/10G/copper/fiber)
x86 Rackmount Network Appliances
- Intel Atom Rangeley
- 1x DDR3 8GB Max
- 4 or 6x RJ45
Rackmount x86 Network Security Platform with Intel® Atom® C2000 Series Processor
- Intel Dual-core Atom C2000 SoC CPU (codenamed "Rangeley")
- Optional rear PCIe expansion slot
- FW-7571A: Built-in 6 GbE LAN ports, FW-7571B:Built-in 4 GbE LAN ports
- Supports Intel QuickAssist Crypto Acceleration
- Supports up to 8 GB ECC DDR3 Memory
- Intel i210AT LAN controller
- 2 system cooling fans
- FW-7571A supports 3rd Generation LAN Bypass function, FW-7571B without LAN Bypass