Lanner, a leading provider of network appliances and SD-WAN solutions, has announced its participation in the MPLS World Congress 2023, which will take place from April 18-20, 2023, in Paris, France, is expected to draw thousands of industry experts and executives to discuss the latest trends, innovations, and best practices in 5G edge computing technologies.
As a sponsor and an exhibitor at booth #H27, Lanner will showcase its latest network appliances, scalable edge servers, and whitebox uCPE designed to enable zero-trust SASE, SD-WAN, Open RAN and SRv6 segment routing.
Featured Products
Scalable Edge Server
Carrier-grade Edge Server Chassis for Open RAN / MEC
CPU |
Depending on compute sled |
Chipset |
Depending on compute sled |
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Open RAN Appliance
Short Depth Chassis Edge Computing Appliance with Intel Xeon® D-2100 Multi-core Processor (Codenamed Skylake-DE)
CPU |
Intel® Xeon® D2100 12/16 Cores |
Chipset |
N/A |
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SASE Appliance
1U 19” Rackmount Network Appliance With Intel Xeon® D-2700 Multi-core CPU (Codenamed Ice Lake D)
CPU |
Intel® Xeon® D2700 10~20 Cores |
Chipset |
N/A |
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Whitebox uCPE
Desktop Network Appliance Powered By Intel® Atom® C5325/C5315 (Parker Ridge) CPU
CPU |
Intel® Atom® C5325/C5315 (Parker Ridge) |
Chipset |
SoC |
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