The V3S is targeted for video surveillance, recording and analytics. As a fanless rugged vehicle NVR system, V3S features next-generation Intel® x86 SoC, rich I/O functionality and environmental endurance, making it highly applicable in smart bus surveillance.
V3S features the new generation 14 nm Intel® Atom™ x7-E3950 SoC (formerly Apollo Lake). This processor consumes low volume of power and offers performance upgrade for vehicle computing needs from previous generation of Atom™ processors.
V3S boasts an abundance of I/O peripheral connectivity including 2 x serial COM ports, 2x video output by DVI-D, USB and Digital I/O ports, 6x RJ-45 ports (4 with PoE or 2 with PoE+) and removable SATA storage bay. To enable wireless network connectivity, V3S offers 2 mini-PCIe sockets with swappable dual SIM slot supporting 3G/4G/LTE cellular communications. In addition, the compact system comes with an option of CAN bus for concerns of driving behavior analysis.
V3S is compliant with E13 standard and has passed MIL-STD-810G shock and vibration resistance certifications to ensure proper operations when traveling on non-flat surfaces. Temperature is another concern when installed within a vehicle interior. Therefore, V3S is built to support wide temperature range, from -40 to 70°C.
Intel® Atom™ x7-E3950
AMI SPI Flash BIOS
DDR3L 1866 SO-DIMM Socket x1
Up to 8GB, pre-installed 4GB
1 x 204-pin SODIMM
1x Removable 2.5” drive bay (HDD/SSD is not included)
4x IEEE 802.3af PoE ports/2x at PoE+ ports (SKU B); under maximum 60W power budget
Intel® Integrated HD Graphics 505
2x DVI-D, up to 1920 x 1200
u-blox NEO-M8N/ADXL 345
8x DI 5V TTL and 8x DO 12V TTL, 2x DI (from MCU) 3.3V TTL 1x 12V with 1A dry relay
2 x USB 2.0 Type A
Power and Mechanical
Supports DC 9~36V level, ATX mode support ignition delay on/off control
1x Full Size Mini-PCIe with dual SIM card reader, 1x Half Size Mini-PCIe, 1x External Mini-PCIe 3.0
Passive CPU heatsink
Fanless design with corrugated aluminum
OS and Certifications
Windows 10, Linux: Redhat Enterprise 5, Fedora 14. Linux Kernel 2.6.18 or later
CE Class A, FCC Class A, RoHS, E13 include ISO 7637-2, SAE J1455&J1113-11
Physical and Environmental
MIL-STD-810G, Method 514.6
-40°C to 85°C
-40~70°C / -40~158°F optional support POE+ x2 (SKU B) or POE x4
5% to 95% (non-condensing)
Dimensions (W x H x D)
273.8 mm x 73 mm x 185 mm (10.78" x 2.87" x 7.28")
Lanner Electronics Inc (TAIEX 6245) is a world leading provider of design, engineering and manufacturing services for advanced network appliances and rugged applied computing platforms for system integrator, service providers and application developers.