Product details

  • Intel® Atom™ x6000E
  • 2x RJ45, 2x HDMI
  • 3x Optional 4G LTE
Rugged In-vehicle Gateway with Multi-WAN Connectivity

  • Intel® Atom™ x6425E Processor (Elkhart Lake)
  • 1x DDR4 3200MT/s SODIMM slot up to 32GB with In Band ECC
  • 3x Removable PGN Series Caddy, 1x M.2 3042 B-Key socket with dual nano-SIM slot for 4G LTE, 1x M.2 2230 E-Key socket for WiFi
  • 2x GbE RJ45, 3x USB 2.0, 1x USB 3.0, 2x HDMI, 1x TPM 2.0 2x RS232/422/485, 1x CAN 2.0, 4x DIO isolation
  • eMMC 64GB up to 128GB storage, 1x SATA
  • Operating temperature: -40~70ºC


The ISD-V330 is a fanless rugged Multi-WAN in-vehicle SD-WAN featuring IoT-enhanced CPU, with rich I/O functionality and environmental endurance, making it highly applicable in smart bus evolution. ISD-V330 features the new generation 10 nm process SoC (System-on-Chip) Intel Atom x6425RE processor (codenamed Elkhart Lake). This processor consumes low volume of power and delivers the required performance for vehicle computing needs, such as vehicle controls, fleet monitoring, and management systems that synchronize inputs from multiple sensors and direct actions in semiautonomous buses, trains, ships, and trucks.

ISD-V330 offers expandable functionality. It boasts an abundance of I/O peripheral connectivity including 1 CAN bus and 2 serial COM ports, 2 video output by HDMI, USB and MIO ports, 2 RJ-45 GbE LAN ports and SATA/mSATA storage options. To achieve multi-WAN aggregate wireless network connectivity, ISD-V330 offers 3 PGN removable caddy with dual SIM slot supporting 4G-LTE/5G cellular communications. In addition, the compact system comes with a native CAN bus for concerns of driving behavior analysis. ISD-V330 is compliant with E13, UL/cUL 62368-1 standard and passes MIL-STD-810G shock and vibration resistance certifications to ensure proper operations when traveling on non-flat surfaces. Temperature is another concern for in-vehicle installation. Therefore, ISD-V330 is built to support wide temperature range, from -40°C to 70°C.

Use Case



Processor System
CPU Intel® Atom™ x6425RE Processor
Frequency 2.0 GHz
Core Number   Quad-core
Chipset SoC
Processor Graphics Intel® UHD Graphics
Technology DDR4 3200MT/s SODIMM with In Band ECC
Max. Capacity 32GB (Default 4GB)
Socket 1x 260-pin SODIMM
Controller Intel i210IT
Interface 2x GbE RJ45
Installation 1x SATA (reserved)
Type eMMC
Installation Onboard eMMC 64GB up to 128GB
Display 2x HDMI with screw lock
CAN 1x CAN 2.0 (option for J1939/J1708)
COM 2x RS-232/422/485
USB 3x USB 2.0, 1x USB 3.0 Type A
GNSS/G-sensor u-blox NEO-M8N/ ADXL 345
Digital I/O 4x digital input with isolation, 5-30V/100mA, 4x digital output with isolation, 30V/ 2A dry relay configurable either N.C. or N.O., 1x IGN_DI to MCU
Antenna 6x SMA antenna hole (includes GNSS)
M.2 1x M.2 3042 B key Socket with dual nano-SIM slot for 4G LTE, 1x M.2 2230 E key Socket for Wi-Fi
Processor Passive CPU heatsink
System Fanless design with corrugated aluminum
Operating Temperature -40~70°C / -40~158°F
Storage Temperature -40~85°C / -40~185°F
Relative Humidity 5%~90% @ 40°C / 104°F (Storage Level)
Hardware Monitoring Yes
Internal RTC with Li Battery Yes
Dimension (W x H x D) 273.8 x 73 x 185 mm (10.78” x 2.87” x 7.28”)
Weight 4 kg
Mounting Wall mount kit
Input Supports DC 9~36V (12/24V) level, support ignition delay on/off control
Connector 3-pin terminal block (+,-,ignition)
Power Consumption (Idle) 16.8W
Power Consumption (Full Load) 21.5W
Driver Support
Microsoft Windows Windows 10 IoT Enterprise
Linux Linux Kernel 5.4
  CE/FCC Class A, E24, UL/cUL 62368-1, MIL-STD-810G anti vibration & shock

Order Information

ISD-V330A Rugged In-vehicle Gateway with Multi-WAN Connectivity with Intel® Atom™ x6425E Processor
PGN-600 4G LTE-Advanced Pro Radio Modem with LTE Cat-12 embedded module, certified with PTCRB, AT&T
PGN 4G LTE Kit PGN-600 FG w/o 4G LTE module
PGN-750D PGN-750D FG w/o 5G Sub6 Module & External Antenna
PGN-750D Antenna Kit 5G Sub 6 ANTENNA KIT for PGN-750D FG


All product specifications are subject to change without prior notice