Lanner to Showcase IEC 61850-3 Certified Platforms for Digital Substation Automation at DISTRIBUTECH 2026 - Lanner Electronics | Network Appliance | uCPE SD-WAN| MEC Server | Intelligent Edge Appliance

 

Lanner Electronics will participate in DISTRIBUTECH 2026, taking place February 3–5, 2026 in San Diego, California, where the company will highlight its latest IEC 61850-3 certified industrial computing solutions designed for next-generation digital substation automation.

At Booth UL322, Lanner will demonstrate how its rugged, utility-grade platforms enable reliable substation communication, protection, and control under harsh operating conditions—supporting the transformation toward smarter, more resilient power grids.

IEC 61850 Rugged Server – ICS-P770

A high-performance, wide-temperature rugged server engineered for substation-level applications, featuring powerful Intel® Xeon® 6 processing, PCIe expansion for HSR/PRP communication modules, and high-speed network I/O—purpose-built for protection, control, and data aggregation in mission-critical power infrastructure.

IEC 61850-3 DIN-Rail Computer – ICS-P375

A compact, IEC 61850-3 compliant DIN-rail platform powered by the Intel® Atom® x7000RE processor, purpose-built for securing SCADA systems with capabilities such as application whitelisting, packet inspection, protocol filtering, and real-time monitoring.

IEC 61850-3 Smart Switch (x86 + Switch Integrated Design)

An innovative platform combining x86 computing with onboard GPU-acceleration, integrated into a Layer 2/Layer 3 managed switch that’s powerful enough to unleash next generation network intelligence through hardware based, edge-AI.

Lanner’s IEC 61850-3 certified portfolio is purpose-built to meet the stringent requirements of substation environments, including electromagnetic compatibility (EMC), temperature extremes, and long lifecycle support—empowering utilities and system integrators to accelerate digital substation deployments with confidence.

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