Powering Digital Substations for the AI Infrastructure

The rapid expansion of AI data centers is reshaping the demands placed on smart power grid infrastructure. At the same time, fluctuating renewable energy generation and energy-intensive AI workloads are accelerating large-scale modernization across global substations and transmission networks.

Lanner delivers a comprehensive portfolio of IEC 61850-3 certified industrial platforms designed to enable next-generation digital substation automation, virtualization, and cybersecurity. The lineup spans rugged rackmount servers, DIN-rail computers, and AI-enabled industrial switches, all engineered to operate reliably in harsh substation environments.

Built with industrial-grade I/O, AI accelerators, power redundancy, surge protection, and wide-temperature operation, these rugged platforms ensure zero-packet-loss communication, real-time data processing and virtualization, and robust network security—strengthening the resilience and reliability of SCADA networks in digital substations.
 

 

 

 


 

Distributech 2026

 

 

Lanner Electronics will participate in DISTRIBUTECH 2026, taking place February 3–5, 2026 At Booth UL322, where the company will highlight its latest IEC 61850-3 certified industrial computing solutions designed for next-generation digital substation automation.

 


 

Pre-validated with Ecosystem Partners

 

Lanner’s IEC 61850 Edge AI platforms integrate seamlessly with a proven ecosystem of processors, operating systems, OT applications, and substation testing partners to accelerate digital substation deployment.

 


 

Rugged Rackmount Server

A high-performance, wide-temperature rugged server purpose-built for substation automation and virtualization. Powered by Intel® Xeon® 6 processors, it delivers high-speed networking with precise time synchronization and flexible PCIe expansion for AI accelerators or HSR/PRP modules—enabling reliable protection, control, and real-time data aggregation across mission-critical power infrastructure.

 

ICS-P770

LEC-3340

  • IEC 61850-3 and IEEE 1613 Certified
  • Intel Xeon 6 Processor (Sierra Forest-SP/64 E-Cores)
  • DDR5 Memory Up to 512GB
  • 4x 2.5GbE RJ45, 2x 10GbE RJ45 or 2x 25GbE SFP28
  • 1x Console, 1x LOM, 5x USB 3.1, 1x VGA
  • 2x FHFL PCIe*16, 1x FHHL PCIe*8, 1x FHHL PCIe*4
  • -40ºC~55ºC Operating Temperature
  • IEC 61850-3 and IEEE 1613 Certified
  • Intel® Xeon® W-11000 series CPU (Tiger Lake H)
  • 2x SO-DIMM DDR4 ECC memory up to 64GB
  • 4x 2.5GbE RJ45, 1x PCIe x16, 3x PCIe x4
  • 5x USB, 2x HDMI, 2x isolated COM
  • 2x 2.5”swappable drive bays, dual power input
  • Wide temperature range -40°C~70°C

 


 

DIN-Rail OT Security Computer

A compact, IEC 61850-3 compliant DIN-rail platform powered by the Intel® Atom® x7000RE processor, purpose-built to safeguard SCADA and substation networks. It enables application whitelisting, deep packet inspection, protocol filtering, and real-time monitoring—delivering robust, deterministic security at the OT edge.

 

ICS-P375

ICS-P570

  • Intel® Atom™ X7000 CPU (Elkhart Lake)
  • DDR5 Memory up to 32GB
  • 4x 2.5G RJ45, 2x GbE RJ45/SFP, LAN bypass
  • 1x Console, 2x COM, 3x USB, 1x DP
  • Onboard EMMC 256GB/32GB, TPM 2.0
  • 1x M.2 Slot for LTE/5G Connectivity
  • AMD Ryzen V1404I Processor
  • 6x RJ45 or 4x RJ45 + 2x SFP (1 pair bypass)
  • 1x RJ45 Console, 1x USB 3.0, 2x DIO
  • 1x M.2 3042 B-Key for LTE module
  • Dual +12~48VDC Power Input
  • Wide Operating Temperature -40~70ºC

 


 

AI-Enabled Industrial Switch

This next-generation AI-enabled industrial switch integrates Intel® Core™ Ultra Series 3 processors with an integrated Intel® Arc™ GPU into a Layer 2/Layer 3 managed platform—purpose-built for multitasking networking that handles advanced workloads such as cybersecurity monitoring, edge inferencing, and sensor data analytics.

 

ICS-P520

  • IEC61850-3, IEEE1613 & EN 50121-4 certified
  • Intel® Core Ultra 300 Series® Processor
  • DDR5 IBECC, 2x SO-DIMM Up to 128GB
  • 2x SFP+24x RJ45(Switch) or 8x SFP+ (Switch)
  • Supports the HSR and PRP redundancy protocol
  • -40 ~ 70ºC Wide Temperature Design