Open RAN Platforms
- 4U Edge Server
- Intel ICE Lake CPU
- Short Depth Chassis
PRELIMINARY
PRELIMINARY
Carrier-grade Edge Server Chassis for Open RAN / MEC- Carrier-grade, full redundancy and extreme high performance
- 3rd Generation Intel® Xeon® Scalable Processor with AI Acceleration
- Support 5x 1U compute sleds or 2x 2U+1U compute sleds
- Support 2x 1U switch sleds for redundancy
- Support OCP NIC 3.0 Modules: 2U: Support FH3/4L double width PCIe Card, 1U: Support FHHL PCIe by 16 card
- 450mm Short Depth Chassis for Edge Deployment
- Distinguished, Flexible and Front I/O Access
- 1+1 Redundant Hot-swappable PSU
- NEBS-3 Compliant for Harsh Conditions
Modules and Acceleration Cards
- IPMI 2.0 Compliant
- OPMA Interface
IPMI (Intelligent Platform Management Interface) Card with GbE management port
- OPMA Interface and IPMI 2.0 Compliant
- Centralized Management and Remote Configuration
- Branding Service
Vehicle/Rail Computer
- Intel Atom x7-E3950
- M-12 LAN and HDMI ports
- 2x M.2, 4x SIM slots
NEW
Fanless Rolling Stock Computer with Intel® Atom™ x7-E3950 Processor
- Intel® Atom™ x7-E3950 Processor
- Certified with EN50155, EN50121, EN50125 and EN45545
- Vehicle/Rail Computer with 6x M12 GbE ports
- 2x M.2 Slots with up to 4x SIM card readers
- Wide range operating temperature from -40 to 70°C
- 2x HDMI and 4x USB ports
- 1x Internal HDD/SSD drive bay
- Support 24~36V or 72~110V power input
Intelligent Video Platform
- 11th Gen Intel® Core i CPU
- 6x PoE+, 2x RJ45, 2x COM
- 2x HDMI, 8x DI, 4x DO
NEW
Computing Vision IPC w/ 11th Gen Intel® CoreTM i Series CPU (Codenamed Tiger Lake-UP3)
- 11th Gen Intel® Core i CPU (Up to i7-1185GRE)
- 2x DDR4 2133/2400 SO-DIMM, Max. 64GB
- 6x PoE+, 2x Ethernet Ports, 2x COM Ports, 4x USB 3.0
- Intel® Iris® Xe Graphics, 2x HDMI, 8x DI & 4x DO
- 1x M.2 B-Key w/ Nano SIM For 5G, 1x M.2 E-Key For WiFi-6
- 1x M.2 M-Key For PCIe Gen4 x4 NVMe SSD
Wide Temperature Network Appliances
- Intel Atom Denverton
- 5G & Wi-Fi 6 Ready
- IP67 & Wide Temp.
NEW
IP67 Rugged 5G Edge Network Appliance
- Fanless Design Compliant with IP67 and MIL-STD-810G
- Intel® Atom® C3000 Extended Temperature CPU (Denverton)
- 2x DDR4 up to 2133 MHz ECC SODIMM Slots, Default 16GB x1
- M12 I/O: SR-IOV for 4x LAN, 2x PoE+, 1x USB, 1x Console
- Wide Operating Temperature: -40~70ºC (SKU D & F)
- 1x M.2 Socket for 5G, 1x M.2 socket for Wi-Fi 6, 1x Mini-SIM
- Intel® QuickAssist Technology
- On-board eMMC 64GB, 1x M.2 2242 B Key, TPM 2.0
vCPE/uCPE Platforms
- Intel® Atom™ x6000E
- 2x RJ45, 2x HDMI
- 3x Optional 4G LTE
NEW
Rugged In-vehicle Gateway with Multi-WAN Connectivity
- Intel® Atom™ x6000E Processor (codenamed: Elkhart Lake)
- 1x DDR4 3200MT/s With SODIMM slot up to 32GB
- eMMC default 64GB, 1x SATA
- 3x PGN Series Removable Caddy, 1x M.2 3042 B key socket with dual nano-SIM slot for 4G LTE, 1x M.2 2230 E key socket for Wi-Fi
- 2x GbE Ethernet, 3x USB 2.0, 1x USB 3.0, 2x HDMI with screw lock, 2x RS232/422/485, 1x CAN 2.0/ J1939/J1708, 4x DIO isolation, TPM
- Operating temperature: -40~70ºC
- 2x HDMI
- GPS+GLONASS dual band, G-sensor
- CE/FCC Class A, E13, MIL-STD-810G anti-vibration & shock
Intelligent Video Platform
- Intel Celeron N3350
- 6x RJ45, 4x USB
- 1x Mini-PCIe
Optimized IoT-ready Solution for Machine Vision and Physical Security
- Intel® Celeron® N3350 or Atom™ x7-E3950
- 6x Ethernet Ports (LEC-2137A/LEC-2137C)
- 2x Ethernet Ports & 4x PoE Ports (LEC-2137B/LEC-2137D)
- 2x USB 3.0, 2x USB 2.0, 1x RS-232/422/485 DB9 Male
- -20°C~55°C Operating Temperatures (LEC-2137A/LEC-2137B)
- 1x HDMI (3840 x 2160), 1x VGA (1600 x 1200)
Embedded Platform
- Intel® Core™ i7/i5/i3
- 2x RJ45, 6x USB
- 2x Mini-PCIe
Fanless Embedded Computer with 3rd Gen Intel Core i7/i5/i3
- Intel® Core™ i7-3612QE/i7-3555LE/i5-3610ME/i3-3120ME
- Expandable PCI or PCIe slot
- Fanless design with corrugated aluminum
- Multiple display output (HDMI, VGA and DVI-D)
- Wide voltage input range (9~30VDC)
- Easily-opened chassis, no tools required
- Various mounting options
- Integrated SIM card reader
- Multi I/O expansion layer
- Remote power control
Embedded Platform
- Intel® Core™ i7/i5/i3
- 2x RJ45, 6x USB
- 1x Mini-PCIe
4th Gen Intel® Core™ i7/i5/i3 Platform with Rich I/O and Expansion
- Intel® Core™ i7/i5/i3 CPU with QM87 PCH
- Intel® HD Graphics 4600
- HDMI/VGA/DVI-D & 3 Independent Display Ports
- 2x USB 3.0 Ports & 4x USB 2.0 Ports
- Mini-PCI-E Slots / 1x PCI or 1x PCI-E x16
- 2x 2.5” HDD/SSD Bays with RAID 0/1
Embedded Platform
- Intel® Core™ i7/i5/i3
- 2x RJ45, 6x USB
- 2x Mini-PCIe
4th Gen Intel® Core™ i7/i5/i3 Platform with Rich I/O and Expansion
- Intel® Core™ i7/i5/i3 CPU with QM87 PCH
- Intel® HD Graphics 4600
- HDMI/VGA/DVI-D & 3 Independent Display Ports
- 2x USB 3.0 Ports & 4x USB 2.0 Ports
- Mini-PCI-E Slots / 2x PCI or 2x PCI-E x8
- 2x 2.5” HDD/SSD Removable Trays with RAID 0/1
Embedded Platform
- 8th Gen. Intel Core™ i7
- 2x RJ45, 4x USB
- 1x Mini-PCIe
NEW
Intelligent Edge Computing Box PC w/ Support for Intel® Core™ i7-8700T/i7-8700
- Intel® Core™ i7-8700T/i7-8700
- 2x DDR4 2133/2400 SO-DIMM, Max. 32GB
- 2x RJ45 GbE LAN, 4x PoE, 4x USB3.0, 6x COM Ports, 8x DI & 8x DO
- 2x Removable HDD/SSD External Slot w/ RAID, 1x mSATA
- 1x PCIe*16, 1x PCIe*4, 1x Mini-PCIe w/ Nano-SIM, 1x B Key M.2 w/ Nano-SIM
Deep Learning Inference Appliances
- Intel® Core™ i7-8700
- 4xPoE, 4xUSB, 6xCOM
- Intel® Movidius™ Myriad
NEW
Edge AI Appliance With Intel® Core™ i7-8700, Myriad X VPU & OpenVINO
- Intel® Core™ i7-8700
- Support Intel® Movidius™ Myriad™ X mPCIe card
- 2x DDR4 2133/2400 SO-DIMM, Max. 32GB
- 2x RJ45 GbE LAN, 4x PoE, 4x USB3.0, 6x COM Ports, 8x DI & 8x DO
- 2x Removable HDD/SSD External Slot w/ RAID, 1x mSATA
- Built-in TPM 2.0 & IPMI Support
Edge AI Appliance
- Intel® Core™ i7-8700
- 4xPoE, 4xUSB, 6xCOM
- NVIDIA® A2 GPU Support
NEW
Nvidia NGC-ready Edge AI Appliance With NVIDIA® A2 GPU Compatibility
- Intel® Core™ i7-8700
- NVIDIA® A2 GPU Card Support
- 2x DDR4 2133/2400 SO-DIMM, Max. 32GB
- 2x RJ45 GbE LAN, 4x PoE, 4x USB3.0, 6x COM Ports, 8x DI & 8x DO
- 2x Removable HDD/SSD External Slot w/ RAID, 1x mSATA
- Built-in TPM 2.0 & IPMI Support
Embedded Platform
- Intel® Celeron® J1900
- 2x RJ45, 5x USB
- 1x Mini-PCIe
Compact High-performance IPC Powered by the Intel® Bay Trail CPU
- Intel® Celeron® J1900 processor
- Fanless design
- 2 Giga LAN ports
- 2 serial COM ports
- 5 USB ports
- Mini-PCIe, PCI and PCI-E riser cards
- 9VDC to 30VDC power input
Intelligent Video Platform
- Intel® Core™ i7/i5/i3
- 6x RJ45, 6x USB
- 2x Mini-PCIe
High-performance IPC with Intel® 6th Gen Skylake Core™ i7/i5/i3 CPU
- Intel® Core™ i7-6600U/i5-6300U/i3-6100U
- Intel® HD Graphics
- 2x HDMI, 3840 x 2160@24Hz or 2560 x 1600@60Hz
- 6x RJ45 (LEC-2580) or 2x RJ45 & 4x PoE (LEC-2580P)
- 4x USB 3.0, 2x USB 2.0
- 2x 2.5” HDD/SSD with RAID 0/1, 4x Serial Ports
- Operating Temperatures: 0°C~60°C (LEC-2580), 0°C~50°C (LEC-2580P)
DIN-Rail Industrial Gateway
- Intel Celeron N2807 CPU
- 2x RJ45, 2x USB
- 4x DI/O
Compact Industrial Grade DIN Rail Box PC with Intel® N2807/E3815 Processor
- Compact-sized industrial grade box PC
- Dual-core Intel Celeron N2807 SoC CPU or Single-core Atom E3815
- ESD/surge protection on serial COM ports for harsh environments
- Wide operating temperature (LEC-3030T:-40~70°C)
- Fanless design with corrugated aluminum
- Support VGA display output
- DIN-Rail or wall mounting options
- Support 4x DI/O
- Dual GbE LAN ports, 1 x USB 2.0, 1 x USB 3.0 port
- 1 x SATA port
DIN-Rail Industrial Gateway
- Intel® Atom E3825 CPU
- 4x RJ45, 2x USB
- 4/6/8/10x COM by SKU
Wide Temperature DIN Rail Box PC with 4G LTE Connectivity Support
- Wide operating temperature range (-40~70°C)
- Intel® Atom™ E3825 SoC CPU
- Front access I/O ports: LEC-3031-A4/6/8: 4/6/8 x RS-232/422/485, LEC-3031-I4/10: 4 or 10 x isolated COM ports
- 2 or 4 x Isolated GbE LAN / 4 x USB:1x USB 3.0, 1x or 3x USB 2.0, VGA port
- 1 x M.2 3042 (USB2.0 signal) for 4G LTE Wireless Expansion
- Fanless and compact design
Rackmount Industrial Computer
- Intel® Xeon®/i3/i5 CPU
- 4x RJ45, 5x USB
- 4x PCIe
NEW
IEC 61850-3 Compliant 3U Rackmount Controller System for Power Substation
- IEC 61850-3 and IEEE 1613 compliant
- Support Intel® Xeon® E3-1505L V6 or i5-7442EQ CPU (Codenamed Kaby Lake-H)
- Redundant power supplies
- Rich I/O: 4x PCIe slots, 4x GbE RJ45 ports, 5x USB 3.0, 2x 2.5”Swappable Drive Bays
- Support DP and DVI display, and 2x Isolated COM ports
- Wide temperature range (-40~70°C)
- Support 2x SO-DIMM DDR4 ECC memory up to 64GB
- Fanless design with corrugated aluminium
- Rack mountable 3U form factor
- Optional TPM 2.0 support
DIN-Rail Industrial Gateway
- Intel® Atom™ E3845 CPU
- 5x RJ45, 2x USB
- 1x COM
Industrial cyber security PC with Intel Atom E3845 CPU and advanced LAN bypass
- Fanless and compact design
- Intel® Atom™ E3845 1.91GHz SoC CPU
- Wide Temperature Support: -40~70ºC
- With 2 x GbE SFP Fiber
- ESD/surge protection on serial COM ports for harsh environments
- 5 x GbE LAN with 1 pair Gen.3 LAN bypass
- DIN rail or wall mounting options
- 1 x USB 3.0 and 1x USB 2.0 port plus internal USB pin-header
Intelligent Video Platform
- Intel® Atom™ E3845
- 6x RJ45, 2x USB
- One Pair Gen.3 LAN Bypass
Industrial Grade PoE Network Appliance with Intel® Atom™ E3845 Processor
- Fanless industrial grade PoE network appliance
- Intel® Atom™ E3845 1.91GHz SoC CPU
- Wide operating temperature from -20 ºC to 55ºC
- Flexible LAN: 2x GbE + 4 x PoE (IEEE 802.3af)
- 1.5 KV magnetic isolation protection on LAN ports
- One pair Gen.3 LAN bypass
- 1x USB 2.0, 1x USB 3.0
- Support DIN rail and wall mount
Wide Temperature Network Appliances
- Intel® Atom™ CPU
- 5x RJ45, 2x USB
- 2x COM
IEC 61850-3 Wide Temperature ICS Cyber Security Gateway with Intel Atom CPU
- Wide Temperature ICS Cyber Security Box PC
- IEC 61850-3 and IEEE 1613 Certified
- Intel® Atom™ x7-E3950 or x5-E3930 CPU
- 5 x GbE LAN with 1 pair bypass, 2 x GbE SFP
- Onboard TPM support
- HDMI display output
- Mini-PCIe with SIM card slot for 4G-LTE support
- 2 x USB 3.0 and 2 x Isolated RS232
Embedded Platform
- Intel® Celeron®, Atom™
- 2x RJ-45, 3x USB
- 1x Mini-PCIe
Small Form Factor Digital Signage PC with Intel® Bay Trail CPU
- Small form factor
- Low power consumption dual-core and quad-core Bay Trail SoC
- Support Intel Atom E3825/E3845 or Celeron J1900/N2930 CPU
- Rich I/O: VGA, HDMI, USB 3.0, 2xLANs, 2COMs, Audio
- Low-power DDR3L Memory support up to 8GB (J11A, N11A, E51A) or 4GB (E21A)
- Intel i210AT LAN controller
- Fanless Design
- Easily opened chassis with No tool required
- Screwed power lock
- Dust proof
Embedded Platform
- Intel® Celeron® J1900
- 2x RJ45, 3x USB
- 1x Mini-PCIe
Compact Fanless Digital Signage IPC with Intel® Bay Trail CPU
- Intel® Celeron® J1900 quad-core processor
- Intel® HD Graphics
- VGA (1600 x 1200) & HDMI (1920 x 1080)
- Dual serial COM ports
- Dual Ethernet ports
- USB 3.0 & USB 2.0 ports
- Mini-PCIe with SIM card reader
- Fanless & dust-proof
Embedded Platform
- Intel® Celeron® J1900
- 2x RJ45, 3x USB
- 1x Mini-PCIe
Compact Fanless All-purpose IPC with Intel® J1900 CPU
- Intel® Celeron® J1900 quad-core processor
- Intel® HD Graphics
- VGA (1600 x 1200) & HDMI (1920 x 1080)
- Dual GbE LAN ports
- Dual RS-232/422/485 serial ports
- USB 3.0 & USB 2.0 ports
- Mini-PCIe with SIM card reader
- Aluminum and SGCC construction