DIN-Rail Industrial Gateway
- Intel® Atom™ X7-E3950
- 4x RJ45 or 2x RJ45+2x SFP
- 2x COM, 2x CAN, 2x M.2
NEW
Robust DIN-rail Fanless Industrial Gateway with LTE/Wi-Fi 6 Connectivity Support
- Intel® Atom™ X7-E3950 / N3350 SoC CPU (formerly Apollo Lake)
- Ethernet: 4x GbE RJ45 (one pair Bypass), SKU B/N/P: 2x GbE RJ45 (one pair Bypass) & 2x SFP
- Front access I/O ports: 2x COM, 2x CAN 2.0(optional for 2x COM), 4x DI/DO, 2x USB 3.0, 1x DB9 console, DP
- Onboard eMMC 64GB, 1x mSATA, optional 1x internal SATA 2.5”drive bay, TPM 2.0
- 1x M.2 B-Key w/ Nano SIM For LTE, 1x M.2 E-Key For Wi-Fi 5/6
- -40 ~ 70ºC (Industrial-grade SKU), 0~50ºC (Commercial grade SKU)
Embedded Platform
- Intel® Apollo Lake
- 3x LAN, 2x COM
- 2x DP, 4x DIO
NEW
Industrial Environment Gateway IPC With Intel® Apollo Lake CPU
- Intel® Apollo Lake CPU
- 3x or 2x GbE LAN, 2x RS232/422/485 COM
- 2x USB 3.0 & 2x USB 2.0, 2x Display Ports, 4x DIO
- 1x M.2 3042 B Key For LTE w/ Dual SIM, 1x M.2 2230 E Key For WiFi
- 1x mSATA, 1x 2.5” SATA Drive Bay (Optional)
- 1x DDR3L SODIMM, Max. 8GB
Vehicle/Rail Computer
- Intel Atom x7-E3950
- M-12 LAN and HDMI ports
- 2x M.2, 4x SIM slots
NEW
Fanless Rolling Stock Computer with Intel® Atom™ x7-E3950 Processor
- Intel® Atom™ x7-E3950 Processor
- Certified with EN50155, EN50121, EN50125 and EN45545
- Vehicle/Rail Computer with 6x M12 GbE ports
- 2x M.2 Slots with up to 4x SIM card readers
- Wide range operating temperature from -40 to 70°C
- 2x HDMI and 4x USB ports
- 1x Internal HDD/SSD drive bay
- Support 24~36V or 72~110V power input
DIN-Rail Industrial Gateway
- AMD Ryzen V1404I CPU
- 6x or 4x GbE RJ45 + 2x SFP
- Optional LTE support
NEW
IEC 61850-3 Wide Temperature Industrial Cybersecurity Gateway
- Comply with IEC 61850-3 and IEEE 1613
- AMD Ryzen V1404I CPU
- 6x GbE RJ45 or 4x GbE RJ45 + 2x GbE SFP
- RJ45 LAN Support One Pair LAN Bypass
- Front-access I/O: RJ45 Console, USB 3.0 and 2x DIO ports
- Optional LTE Module Support
- Dual +12~48Vdc Power Input
- Wide Operating Temperature -40~70ºC
DIN-Rail Industrial Gateway
- Intel® Atom™ X6000E CPU
- 6x 2.5 GbE RJ45 + 2x SFP
- Optional LTE/Wi-Fi/5G-sub6
NEW
IEC 61850-3 Wide Temperature Industrial Cybersecurity Gateway
- IEC 61850-3 and IEEE 1613 Certified
- Intel® Atom™ X6211E/X6413E/X6425E CPU (formerly Elkhart Lake)
- 6x 100M/1G/2.5 GbE RJ45 with 1 pair bypass, 2x GbE SFP, TPM 2.0, 1x COM, 2x USB, 2x DIO
- Chassis Intrusion Detect, Optional Wi-Fi 6E & IPMI support
- 1x M.2 B-Key w/ dual-Nano SIM For LTE/5G-sub6, 1x M.2 E-Key for Wi-Fi module (By SKU)
- Dual +12~48Vdc Power Input, Operating Temperature -40~70ºC
DIN-Rail Industrial Gateway
- Intel Atom x7-E3950/x5-E3940
- Front access RJ45, SFP, DIO
- 2x SIM, 1x DP, 2x M.2
NEW
Industrial-Grade Cyber Security Appliance with Intel® Atom™ E3900 Processor
- Industrial Grade Cyber Security Platform
- Intel® Atom™ x7-E3950/x5-E3940 (Apollo Lake)
- 8x, 6x or 4x GbE RJ45 ports with 1 or 2 pairs Bypass, SKU C,D,F with 2x GbE SFP
- 2x USB 3.0, 1x DB9 console, 2x DIO, 64GB eMMC onboard
- 1x M.2 B-Key for LTE/5G sub6 with dual SIM, 1x M.2 E-Key for WiFi
- Onboard TPM 2.0
Modules and Acceleration Cards
- IPMI 2.0 Compliant
- OPMA Interface
- Security Using TLS 1.3 Over HTTPS
- IPv4/IPv6 Remote
HybridTCA Platforms
- 4U Edge Server
- Intel ICE Lake CPU
- Short Depth Chassis
NEW
Carrier-grade Edge Server Chassis for Open RAN / MEC
- Carrier-grade, full redundancy and extreme high performance
- 3rd Generation Intel® Xeon® Scalable Processor with AI Acceleration
- Support 5x 1U compute sleds or 2x 2U+1U compute sleds
- Support 2x 1U switch sleds for redundancy
- Support OCP NIC 3.0 Modules: 2U: Support FH3/4L double width PCIe Card, 1U: Support FHHL PCIe by 16 card
- 450mm Short Depth Chassis for Edge Deployment
- Distinguished, Flexible and Front I/O Access
- 1+1 Redundant Hot-swappable PSU
- NEBS-3 Compliant for Harsh Conditions
HybridTCA Platforms
- 12x Cascade Lake CPU
- 2x Switch, 4x Ether Blade
- NEBS compliant design
High Availability Chassis 6U Telecom Network Appliance with 6 x86 CPU Blades and 6 I/O Blades
- High availability, full redundancy and extreme high performance
- 6 CPU blades in the rear, per blade supports up to 2 Intel® Xeon® Processor Scalable Family CPUs and 16x DDR4 R-DIMM
- 6 x Swappable I/O blades on the front, supporting up to 2x Switch blades or 6x Ethernet blades; 6x swappable 3.5” HDD bays
- Blade 1~2: Switch fabric blade or Blade 1~6: Ethernet I/O blade
- NEBS compliant design
- Redundant power supply and removable fan module
HybridTCA Platforms
- 8x Scalable Xeon CPUs
- 2x Switch, 1x Storage Blade
- NEBS compliant design
NEW
High Availability Chassis 4U Telecom Network Appliance with 4 x86 CPU Blades and 2x Switch blades for redundancy, Storage blades with 10x NVMe SSD or Network blades
- High availability, full redundancy and extreme high performance
- 4 compute blades in the rear, per blade supports up to dual Intel® Xeon® Scalable (Skylake-SP) CPUs and 16x DDR4 R-DIMM
- Upper 2 slots: 2x switch blades in upper two slots for redundancy or 2x Ethernet blades
- Bottom 2 slots: Storage blades with 10x NVMe SSD in bottom two slots or up to 2x Ethernet blades
- Max. up to 80 ports 10G SFP+ Ethernet ports (4x Ethernet blades)
- N+N Redundant power supply and removable fan module
- NEBS compliant design
HybridTCA Platforms
- Max. 4x Broadwell-EP CPUs
- 2x Switch/Ethernet Blade
- NEBS compliant design
High Availability Chassis 2U Telecom Network Appliance with 2 x86 CPU Blades and 2 I/O Blades
- High availability, full redundancy and extreme high performance
- 2 CPU blades in the rear, per blade supports up to 2 Intel® Xeon® Processor Scalable Family CPUs and 16x DDR4 R-DIMM
- Blade 1~2: Switch fabric blade or ethernet I/O blade
- 2 x Swappable I/O blades in front, supporting up to 2 switch blades or Ethernet blade configuration
- Redundant power supply and removable fan module
- NEBS compliant design
Open RAN Platforms
- Intel Ice Lake CPU
- Double-Width FH3/4L PCIe
- Support OCP NIC 3.0
NEW
2U Compute Sled for HTCA-E400
- Support 3rd Gen Intel Xeon Scalable Processor (codenamed Ice lake)
- Front Access I/O: Storage bays x4, PCIe x1, OCP NIC slot x1, mini-DP port (VGA signal), LOM and USB 3.0 ports
- Support FH3/4L double width or single width PCIe Card
- Support OCP NIC 3.0 Modules
- Compatible with HTCA-E400 Series
Open RAN Platforms
- Intel Ice Lake CPU
- 1x PCIe slot
- Support OCP NIC 3.0
NEW
Modules and Blades
- 2x 4th Gen Intel Xeon CPU
- Max. 1024GB Memory
- Built-in Intel QAT
PRELIMINARY
PRELIMINARY
Compute Blade for HTCA-6000 Series Powered by 4th Generation Intel® Xeon® Scalable Processors (Sapphire Rapids)- Hot swappable x86 compute blade
- Support dual 4th Generation Intel® Xeon® Scalable Processors (codenamed Sapphire Rapids) and Emmitsburg PCH
- DDR5 4800 MHz REG DIMM, 16x 288pin DIMM Socket, LRDIMM 1024GB (16 x 64GB) per M/B tray
- Built-in Intel QuickAssist Technology (QAT)
- 4x KR4 supporting 4x 100G to front Switch blades
- 5x Hot swappable smart fans
Modules and Blades
- 2x Intel Xeon Cascade Lake
- Max. 512GB Memory
- 5x Hot Swappable Fans
Compute Blade for HTCA-6000 Series Powered by 2nd Generation Intel® Xeon® Scalable Processors
- Hot swappable x86 compute blade
- Support dual 2nd Generation Intel® Xeon® Scalable Processors (codenamed Skylake-SP/Cascade Lake) C621/C627 PCH
- 16x 288-pin DDR4 DIMMs, max. up to 512GB memory capacity
- 4x KR4 supporting 4x 100G to front Switch blades
- 5x Hot swappable smart fans
Modules and Blades
- Intel Atom E3800
- Max. 8GB Memory
- HLM1020 Compatible
Open RAN Platforms
- 10/25/100GbE fiber
- Intel Tofino Switch
- Optional IEEE 1588
NEW
Modules and Blades
- 14x QSFP28 Ports
- Intel Tofino Switch
- For HTCA-6600 Series
NEW
Modules and Blades
- 2xQSFP28+16xSFP+4xRJ45
- Broadcom Trident-III
- For HTCA-6000 Series
Modules and Blades
- 20x 10GbE SFP+
- Intel XL710 Controller
- For HTCA-6000 Series
Modules and Blades
- 1U Height Form Factor
- 6x NVMe SSD Trays
- Hot Swappable
NEW
Modules and Blades
- 6x100G/4x40G/6x10G SFP
- Broadcom Tomahawk
- For HTCA-6000 Series
Customized Products
NEW
2U 19” Rackmount Server Platform Built With 3rd Gen Intel® Xeon® Scalable Processor (Codenamed Ice Lake SP)
- Dual 3rd Gen Intel® Xeon® Scalable Processor
- 24x DDR4 2133/2400/2666/2933 MHz, Max. 1536GB
- 2x NIC Slots, 2x GbE RJ45, 1x RJ45 Console, 1x LOM, 2x USB 3.0
- 1x PCIe*4/8/16 Gen 4 Expansion, 3x M.2 2280 (NVME & SATA)
- 8x 2.5” HDD/SSD Bays, 2x MicroSD/SD (Optional)
- 4x Individual How-swappable Fans
Customized Products
NEW
2U 19” Rackmount Server Built With 3rd Gen Intel® Xeon® Scalable Processor (Codenamed Ice Lake SP)
- Dual 3rd Gen Intel Xeon Scalable Processor
- 24x DDR4 2133/2400/2666/2933/3200MHz, Max 1536GB
- 8x NIC Slots, 2x GbE RJ45, 1x Console, 1x LOM, 2x USB3.0
- PCIe *4/8/16 Gen 4 Expansion, 3x M.2
- 2x 2.5” HDD/SSD Bays Or 1x 2.5” HDD/SSD Bay And 2x MicroSD/SD
- BIOS Recovery, TPM 2.0
- 4 Hot-swappble fans, 1300W/2000W 1+1 ATX Redundant PSUs (Optional)