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• Fabric interface switch blade with 14x 100GbE QSFP28
• Intel Tofino T10-032D 3.2Tbps bandwidth Multilayer Switch
• P4 programmable
• Compatible with HTCA-6600 Series

• Fabric interface with 6x 100GbE QSFP28, 8x 10/25GbE SFP+
• Intel Tofino Series (BFN-T10-032D-B0) the maximum bandwidth up to 3.2 Tb/s.
• Compatible with HTCA-E400 Series

• Intel Atom SoC Processor E3800 Product Family
• DDR3 SODIMM Socket up to 8GB DDR3L Non-ECC Memory
• Use SAMTEC connector to connect HLM-1020

• Hot swappable x86 compute blade
• Support dual 2nd Generation Intel® Xeon® Scalable Processors (codenamed Skylake-SP/Cascade Lake) C621/C627 PCH
• 16x 288-pin DDR4 DIMMs, max. up to 512GB memory capacity
• 4x KR4 supporting 4x 100G to front Switch blades
• 5x Hot swappable smart fans

PRELIMINARY

• Hot swappable x86 compute blade
• Support dual 4th Generation Intel® Xeon® Scalable Processors (codenamed Sapphire Rapids) and Emmitsburg PCH
• DDR5 4800 MHz REG DIMM, 16x 288pin DIMM Socket, LRDIMM 1024GB (16 x 64GB) per M/B tray
• Built-in Intel QuickAssist Technology (QAT)
• 4x KR4 supporting 4x 100G to front Switch blades
• 5x Hot swappable smart fans

• Support 3rd Gen Intel Xeon Scalable Processor (codenamed Ice lake)
• Front Access I/O: Storage bays x2, PCIe x1, NIC slot x1, mini-DP port, LOM and USB 3.0 ports
• Support FHHL PCIe by 16 card
• Support OCP NIC 3.0 Modules
• Compatible with HTCA-E400 Series

• Support 3rd Gen Intel Xeon Scalable Processor (codenamed Ice lake)
• Front Access I/O: Storage bays x4, PCIe x1, OCP NIC slot x1, mini-DP port (VGA signal), LOM and USB 3.0 ports
• Support FH3/4L double width or single width PCIe Card
• Support OCP NIC 3.0 Modules
• Compatible with HTCA-E400 Series

• High availability, full redundancy and extreme high performance
• 2 CPU blades in the rear, per blade supports up to 2 Intel® Xeon® Processor Scalable Family CPUs and 16x DDR4 R-DIMM
• Blade 1~2: Switch fabric blade or ethernet I/O blade
• 2 x Swappable I/O blades in front, supporting up to 2 switch blades or Ethernet blade configuration
• Redundant power supply and removable fan module
• NEBS compliant design

Available Blades

• High availability, full redundancy and extreme high performance
• 4 compute blades in the rear, per blade supports up to dual Intel® Xeon® Scalable (Skylake-SP) CPUs and 16x DDR4 R-DIMM
• Upper 2 slots: 2x switch blades in upper two slots for redundancy or 2x Ethernet blades
• Bottom 2 slots: Storage blades with 10x NVMe SSD in bottom two slots or up to 2x Ethernet blades
• Max. up to 80 ports 10G SFP+ Ethernet ports (4x Ethernet blades)
• N+N Redundant power supply and removable fan module
• NEBS compliant design

Available Blades

• High availability, full redundancy and extreme high performance
• 6 CPU blades in the rear, per blade supports up to 2 Intel® Xeon® Processor Scalable Family CPUs and 16x DDR4 R-DIMM
• 6 x Swappable I/O blades on the front, supporting up to 2x Switch blades or 6x Ethernet blades; 6x swappable 3.5” HDD bays
• Blade 1~2: Switch fabric blade or Blade 1~6: Ethernet I/O blade
• NEBS compliant design
• Redundant power supply and removable fan module

Available Blades

• Carrier-grade, full redundancy and extreme high performance
• 3rd Generation Intel® Xeon® Scalable Processor with AI Acceleration
• Support 5x 1U compute sleds or 2x 2U+1U compute sleds
• Support 2x 1U switch sleds for redundancy
• Support OCP NIC 3.0 Modules: 2U: Support FH3/4L double width PCIe Card, 1U: Support FHHL PCIe by 16 card
• 450mm Short Depth Chassis for Edge Deployment
• Distinguished, Flexible and Front I/O Access
• 1+1 Redundant Hot-swappable PSU
• NEBS-3 Compliant for Harsh Conditions

Available Blades

• OPMA Interface and IPMI 2.0 Compliant
• Centralized Management and Remote Configuration
• Branding Service

• Industrial-Grade Cyber Security Platform
• Intel® Atom™ x7-E3950 / x5-E3940 (Apollo Lake)
• 8x, 6x or 4x GbE RJ45 ports with 1 or 2 pairs Bypass, SKU C,D,F with 2x GbE SFP
• Onboard TPM 2.0
• 2x USB 3.0, 1x DB9 console, 2x DIO, 64GB eMMC onboard
• M.2 B-Key for LTE/5G sub6 with dual SIM, M.2 E-Key for WiFi

• IEC 61850-3 and IEEE 1613 Certified
• Intel® Atom™ X6211E/X6413E/X6425E CPU (formerly Elkhart Lake)
• 6x 100M/1G/2.5 GbE RJ45 with 1 pair bypass, 2x GbE SFP, TPM 2.0, 1x COM, 2x USB, 2x DIO
• Chassis Intrusion Detect, Optional Wi-Fi 6E & IPMI support
• 1x M.2 B-Key w/ dual-Nano SIM For LTE/5G-sub6, 1x M.2 E-Key for Wi-Fi module (By SKU)
• Dual +12~48Vdc Power Input, Operating Temperature -40~70ºC

• Comply with IEC 61850-3 and IEEE 1613
• AMD Ryzen V1404I CPU
• 6x GbE RJ45 or 4x GbE RJ45 + 2x GbE SFP
• RJ45 LAN Support One Pair LAN Bypass
• Front-access I/O: RJ45 Console, USB 3.0 and 2x DIO ports
• Optional LTE Module Support
• Dual +12~48Vdc Power Input
• Wide Operating Temperature -40~70ºC

• Intel® Atom™ x7-E3950 Processor
• Certified with EN50155, EN50121, EN50125 and EN45545
• Vehicle/Rail Computer with 6x M12 GbE ports
• 2x M.2 Slots with up to 4x SIM card readers
• Wide range operating temperature from -40 to 70°C
• 2x HDMI and 4x USB ports
• 1x Internal HDD/SSD drive bay
• Support 24~36V or 72~110V power input

• Intel® Apollo Lake CPU
• 3x or 2x GbE LAN, 2x RS232/422/485 COM
• 2x USB 3.0 & 2x USB 2.0, 2x Display Ports, 4x DIO
• 1x M.2 3042 B Key For LTE w/ Dual SIM, 1x M.2 2230 E Key For WiFi
• 1x mSATA, 1x 2.5” SATA Drive Bay (Optional)
• 1x DDR3L SODIMM, Max. 8GB

• Intel® Atom™ X7-E3950 / N3350 SoC CPU (formerly Apollo Lake)
• Front access I/O ports: 2x COM, 2x CAN 2.0(optional for 2x COM), 4x DI/DO, 2x USB 3.0, 1x DB9 console, DP, SKU A/M/O: 4x GbE RJ45 (one pair Bypass), SKU B/N/P: 2x GbE RJ45 (one pair Bypass) & 2x SFP
• Onboard eMMC 64GB, 1x mSATA, optional 1x internal SATA 2.5”drive bay, TPM 2.0
• 1x M.2 B-Key w/ Nano SIM For LTE, 1x M.2 E-Key For Wi-Fi 5/6
• Wide operating temperature range: -40~70°C for industrial SKU A/B

• 11th Gen Intel® Core i CPU (Up to i7-1185GRE)
• 2x DDR4 2133/2400 SO-DIMM, Max. 64GB
• 6x PoE+, 2x 2.5 Gbps RJ45, 2x COM Ports, 4x USB 3.0
• Intel® Iris® Xe Graphics, 2x HDMI, 8x DI & 4x DO
• 1x M.2 B-Key w/ Nano SIM For 5G, 1x M.2 E-Key For WiFi-6
• 1x M.2 M-Key For PCIe Gen4 x4 NVMe SSD

• 11th Gen Intel® CoreTM i CPU (Up to i7-1185GRE)
• Pre-installed 1x M.2 B+M Key Hailo-8™ AI Accelerator
• 2x DDR4 2133/2400 SO-DIMM, Max. 64GB
• 6x PoE+, 2x Ethernet Ports, 2x COM Ports, 4x USB 3.0
• Intel® Iris® Xe Graphics, 2x HDMI, 8x DI & 4x DO
• 1x M.2 B-Key w/ Nano SIM For 5G, 1x M.2 E-Key For WiFi-6
• 1x M.2 M-Key For PCIe Gen4 x4 NVMe SSD

• 11th Gen Intel® Core i CPU (Up to i7-1185GRE)
• 2x DDR4 3200 IBECC SO-DIMM, Max. 64GB
• 4x PoE+, 2x Ethernet Ports, 4x COM Ports, 4x USB 3.0
• Intel® Iris® Xe Graphics, 2x HDMI, 4x DI & 4x DO
• 1x M.2 B-Key w/ Nano SIM For 5G, 1x M.2 E-Key For WiFi, 1x mSATA

• Fanless Design Compliant with IP67 and MIL-STD-810G
• Intel® Atom® C3000 Extended Temperature CPU (Denverton)
• 2x DDR4 up to 2133 MHz ECC SODIMM Slots, Default 16GB x1
• M12 I/O: SR-IOV for 4x LAN, 2x PoE+(By SKU), 1x USB, 1x Console
• Wide Operating Temperature: -40~70ºC or -40~60ºC (By SKU)
• 1x M.2 Socket for 5G, 1x M.2 socket for Wi-Fi 6, 1x Mini-SIM
• Intel® QuickAssist Technology
• On-board eMMC 128GB, 1x M.2 2242 B Key, TPM 2.0

• Intel® Atom™ x6425RE Processor (codenamed Elkhart Lake)
• 1x DDR4 3200MT/s SODIMM slot up to 32GB with In Band ECC
• eMMC 64GB
• 3x PGN Series Removable Caddy, 1x M.2 3042 B key socket with dual nano-SIM slot for 4G LTE, 1x M.2 2230 E key socket for Wi-F
• 2x GbE Ethernet, 3x USB 2.0, 1x USB 3.0, 2x HDMI, 1x TPM 2.0 2x RS232/422/485, 1x CAN 2.0, 4x DIO isolation
• Operating temperature: -40°C~70°C
• 2x HDMI
• GPS+GLONASS dual band, G-sensor
• CE/FCC Class A, E13, MIL-STD-810G anti-vibration & shock

• Intel® Celeron® N3350 or Atom™ x7-E3950
• 6x Ethernet Ports (LEC-2137A/LEC-2137C)
• 2x Ethernet Ports & 4x PoE Ports (LEC-2137B/LEC-2137D)
• 2x USB 3.0, 2x USB 2.0, 1x RS-232/422/485 DB9 Male
• -20°C~55°C Operating Temperatures (LEC-2137A/LEC-2137B)
• 1x HDMI (3840 x 2160), 1x VGA (1600 x 1200)