Modules and Acceleration Cards
- Intel® Lewisburg
- Intel® QAT
NEW
Deep Learning Inference Appliances
- NVIDIA® Jetson Xavier
- Max. 21 TOPS AI
- 384-core NVIDIA Volta GPU
Industrial Grade AI Inference System For 5G Edge With NVIDIA® Jetson Xavier NX/Jetson Nano
- NVIDIA® Jetson Xavier NX/Jetson Nano
- AI Performance Up To 21 TOPS
- Up To 384-core NVIDIA Volta™ GPU With 48 Tensor Cores
- 5G and WiFi 6 Supported
- 2x GigE PoE LAN With Support For IEEE 802.3 af/at PoE+ (By SKU)
- 1x HDMI 2.0A/B, 2x USB 2.0, 2x RS232/422/485 (Optional COM2 For CAN 2.0 A/B)
- TPM 2.0 onboard
- TrustZone With Security Boot & OS Protected
Deep Learning Inference Appliances
- NVIDIA Jetson Orin™
- 100 TOPS AI Performance
- -40°C ~ 70°C/75°C Ranges
NEW
Industrial-grade AI Inference System For 5G Edge With NVIDIA® Jetson Orin NX/Nano
- NVIDIA® Jetson Orin NX/Nano
- AI Performance Up To 100 TOPS
- Up To 1024-core NVIDIA CUDA GPU With 32 Tensor Cores
- Support For 4G LTE/ 5G Sub6 & WiFi
- 2x GigE IEEE 802.3 af PoE/ at PoE+ LAN, 2x USB 2.0, 1x HDMI, 2x RS232/422/485 (Optional COM2 For CAN 2.0)
- TPM 2.0 onboard
- TrustZone With Security Boot & OS Protected
Deep Learning Inference Appliances
- NVIDIA Jetson Orin™
- 100 TOPS AI Performance
- 3x RJ45, 4x USB, LTE/5G
NEW
5G Edge AI Gateway with NVIDIA Jetson Orin NX / Nano
- NVIDIA® Jetson Orin NX/Nano
- AI Performance Up To 100 TOPS
- Up To 1024-core NVIDIA CUDA GPU With 32 Tensor Cores
- Support For 4G LTE/ 5G Sub6 & WiFi
- 3x GbE RJ45, 2x USB 3.0 Gen1, 2x USB 2.0, 1x HDMI, 2x RS232
- USB 3.0 64/128GB boot storage & 1x M.2 2280 NVMe SSD
- Onboard TPM 2.0
Intelligent Video Platform
- Intel® Core™ Ultra 7/5
- 2x COM Ports, 4x USB Ports
- 3x 2.5GbE RJ45
NEW
AI Inference System for Retail Applications with Intel® Core™ Ultra 7/5 CPU (Meteor Lake-H/U)
- Intel® Core™ Ultra Processor (Meteor Lake-H/U)
- 2x DDR5 5600 non-ECC SODIMM, up to 96GB/48GB
- 3x 2.5GbE RJ45 & 1x GbE RJ45 (optional OOB), 2x COM Ports, 4x USB Ports
- 1x DP1.2 Port, 4x DI & 4x DO
- 1x M.2 2230 E-Key for WiFi 6/6E, 1x M.2 3042/3052 B-Key for LTE/5G, 2x SIM Slots
- TPM 2.0 onboard, Operating Temperature 0°C~40°C, UL/CB 62368-1 compliant
Deep Learning Inference Appliances
- Intel® i9/i7 Processors
- 2x 2.5GbE RJ45
- 8x USB 3.2
new
Industrial Grade High Performance AI Platform With 13th Gen. Intel® Core i9/i7 Processors
- 13th Gen. Intel® Core i9/i7 Processors (codename: Raptor Lake-S)
- 3200MHz DDR4 SODIMM Up to 64GB, 4x 2.5” Removable HDD/SSD
- 2x 2.5GbE RJ45, 1x RJ45 Console, 1x RJ45 LOM (By SKU)
- 2x RS232/422/485 COM, 8x USB 3.2 (Gen2, Type A)
- 1x M.2 (NVMe) 2280 M-Key, 2x SATA M.2 2242 M-Key
- 2x PCIe*16, 2x PCIe*4, 1x Nano-SIM & eSIM, 1x HDMI,1x DP, 4x DI & DO
- -25ºC~65ºC Operating Temperatures
AI Starter Kits
- 13th Gen Intel® i9/i7 CPU
- Built-in SiMa.ai’s MLSoC™
- 2x 2.5G RJ45, 2x COM, 8x USB
new
Industrial Grade High Performance AI Platform With the Built-in SiMa.ai’s MLSoC™
- 13th Gen Intel® Core i9/i7 Processors (codename: Raptor Lake-S)
- 3200MHz DDR4 SODIMM Up to 64GB, 4x 2.5” Removable HDD/SSD
- -Built-in SiMa.ai’s MLSoC™
- 2x 2.5GbE RJ45, 1x RJ45 Console, 1x RJ45 LOM (By SKU)
- 2x RS232/422/485 COM, 8x USB 3.2 (Gen2, Type A)
- 1x M.2 (NVMe) 2280 M-Key, 2x SATA M.2 2242 M-Key
- 2x PCIe*16, 2x PCIe*4, 1x Nano-SIM & eSIM, 1x HDMI,1x DP, 4x DI & DO
- -25ºC~65ºC Operating Temperatures
Deep Learning Inference Appliances
- Intel® i9/i7 Processors
- 2x 2.5GbE RJ45
- 2x COM & 8x USB 3.2
Preliminary
Compact AI Platform with 12th/13th Gen Intel® i9/i7 Processors for Industrial Applications
- 12th/13th Gen.Intel® i9/i7/i5/i3 Processors
- DDR4 SODIMM Up to 64GB
- 2x 2.5GbE RJ45, 1x RJ45 Console, 1x RJ45 LOM (By SKU)
- 2x COM, 8x USB 3.2, 1x HDMI, 1x DP, 4x DI & DO
- 2x 2.5” Removable HDD/SSD
- 1x M.2(SATA) 2242 B-Key, 1x M.2(NVMe) 2280 M-Key
Vehicle/Rail Computer
- 13th Gen. Intel® Core™
- 2x 2.5GbE POE+ LAN
- EN50155 & EN45545
NEW
AI Acceleration Railway Computer with Intel® Raptor Lake-P CPU
- 13th Generation Intel® Core™ Processor (Raptor Lake-P)
- Certified with EN50155 and EN45545 Standard
- Hailo-8™ AI Acceleration Module & NVIDIA MXM GPU Module Support
- 2x 2.5GbE PoE+ LAN, 4x 2.5GbE LAN, 1x USB 2.0, 2x USB 3.2, 2x HDMI
- Support 4x Removable PGN Series Caddies for 5G/LTE connectivity
- 1x Removable 2.5” drive bay
Vehicle/Rail Computer
- Intel® Atom™ X6000 series
- 4x USB, 2x HDMI
- 7x RJ45 ports
new
Fanless In-vehicle AI Inference System with Intel® Elkhart Lake Processor
- Intel® Atom™ X6000 Series Processor (codename: Elkhart Lake-I)
- 1x SODIMM DDR4, Up to 32GB
- eMMC 128GB, 1x SATA
- 1x PGN Series Removable Caddy, 1x M.2 304(5)2 B Key socket (USB 3.0/PCIe x1) for 4G LTE/ 5G sub6, 1x M.2 2230 E key socket for Wi-Fi
- 7x RJ45 ports (2x GbE LAN w/I210IT, 4x PoE+w/1x i210IS, 1x OOB (by SKU)
- 3x USB 2.0, 1x USB 3.0, 2x HDMI, 1x TPM 2.0
x86 Rackmount Network Appliances
- Intel® Xeon D-2100
- Short Depth Chassis
- Wide Temperature
1U 19” Rackmount Open RAN Appliance with Intel Xeon® D-2100 Multi-core Processor (Codenamed Skylake-DE)
- Intel® Xeon D-2100 8/12/14/16 Cores Processor
- Short Depth Chassis and Wide Operating Temperature -40~65ºC
- 2x DDR4 2667 MHz REG, ECC RDIMM, Max. 64GB
- Front Access I/O with 1x GbE RJ45 for IPMI, 8x 10G SFP+, 1x RJ45 Console, 1x USB 3.0 and Screw-less Fan Replacement
- 4x 2.5” Internal HDD/SSD Bays, 1x M.2 NVMe 2280 M key
- 1x PCI-E x16 slot for FPGA or GPU cards (Max. up to 75W)
- Intel® QuickAssist Technology
x86 Rackmount Network Appliances
- Intel® Xeon D-2100
- Short Depth Chassis
- Wide Temperature
Short Depth Chassis Edge Computing Appliance with Intel Xeon® D-2100 Multi-core Processor (Codenamed Skylake-DE)
- Intel® Xeon D-2100 12/16 Cores Processor
- Wide Operating Temperature -40~65ºC
- 2x DDR4 2667 MHz REG, ECC RDIMM, Max. 64GB
- Front Access I/O: 1x GbE RJ45 IPMI, 8x 10G SFP+, 2x 40G QSFP+, 1x RJ45 Console, 1x USB 3.0 and Front Fan Replacement
- 2x 2.5” Internal HDD/SSD Bays, 2x M.2 NVMe 2280 M key
- 1x PCI-E*16 FH/HL slot for FPGA or GPU cards
- Optional G.8272 T-GM Compliant IEEE 1588v2 SynE, onboard GPS
x86 Rackmount Network Appliances
- Intel® Xeon D-2800/2700
- DDR4 Max. 256GB
- 8x 10G SFP+, 2x 25G SFP28
NEW
High Performance Edge Computing Appliance With Intel Xeon® D-2800 Series Multi-core Processor (Codenamed Eddy Lake D)
- Intel® Xeon® D2700/2800 8~22 Cores
- 4x DDR4 3200/2933MHz REG RDIMM, Max. 256GB
- 8x 10G SFP+, 2x 25G SFP28, 2x GbE RJ45, 2x USB 3.0
- 1x RJ45 Console, 2x 2280 M.2 (1x NVMe & 1x SATA)
- -40C~65C Operating Temperature (SKU B/C/E)
- 1x OCP 3.0, 1x PCIe*16
x86 Rackmount Network Appliances
- Intel Xeon (Emerald Rapids)
- OCP 3.0 NIC, TPM
- 3x PCIe Slots
NEW
5G Edge Server With The 5th Gen Intel® Xeon® Scalable Processors (Codenamed Emerald Rapids)
- 5th Gen Intel® Xeon® Scalable Processors
- Intel vRAN Boost Support (For 4th Gen Intel® Xeon® Scalable Processors Only)
- Short Depth Chassis and Front I/O Design
- 16x DDR5 4400MHz RDIMM, Max. 1024GB
- 1x OCP 3.0 NIC Module
- 0 ~ 50ºC Operating Temperature (By CPU SKU)
- 2x M.2 NVMe 2280, 2x 2.5’’ SATA/ U.2
- 1x FHFL PCIex 16 slot, 2xLP or 1xFHHL slot (PCIex8)
- Secure BMC / TPM 2.0
- A NVIDIA-Certified System for industrial edge
x86 Rackmount Network Appliances
- 5th Gen Intel® Xeon® CPUs
- 2x FH3/4L, 2x LP, 1x OCP3.0
- 4x 2.5" HDD/SSD Drive Bays
NEW
2U 19” Appliance With 5th Gen Intel® Xeon® Scalable Processors
- 5th Gen Intel® Xeon® Scalable Processors
- 16x DDR5 RDIMM, Max. 1024 GB System Memory
- PCIe Slots: 2x FH3/4L, 2x LP
- 1x GbE RJ45,1x OCP3.0, 2x USB3.0
- 4x 2.5" HDD/SSD Drive Bays
- 1x M.2 NVMe (PCIe) 2242/2260 M Key, 1x M.2 (SATA) 2280 BB+M key
- 6x Smart Fans
- Intel QAT
x86 Rackmount Network Appliances
- NVIDIA MGX Architecture
- Intel Xeon or NVIDIA GH200 CPU
- 3x PCIe Slots, 2x E1.S SSD
Preliminary
2U 19” Modular Edge AI Server Platform Based On NVIDIA MGX Architecture
- NVIDIA Grace™ Hopper CPU Or Intel® Xeon®6 Processor
- 8x DDR5 6400MHz RDIMM, Max. 1536GB System Memory
- 2x Or 1x PCIe*16 FH 3/4L, 1x PCIe*16 FHHL Or 1x PCIe*16 LP(By SKU)
- 1x GbE RJ45, 1x RJ45 Console, 1x USB 3.0
- 2x M.2 NVMe (PCIe), 2x E1.S SSD
- 6x Smart Fans, 2x 1600W AC CRPS PSU
Deep Learning Accelerators
- Hailo-8™ AI Processors
- PCI Express x16/x8/x4
NEW
Best Efficient PCIe AI Accelerator Card Powered by Hailo-8™ AI Processors
- Best-in-class Performance And Cost-efficiency
- Scalable, Supports 1, 2 Or 4 Hailo-8™ AI Processors
- High Power Efficiency, Low Power Consumption
- Commercial And Industrial Grade Support
- Enablement Software Package With Advanced Deep Learning Models And AI Reference Applications
- Hailo-8™ Software Development Tools Significantly Reduce Time To Market For AI Applications
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Deep Learning Accelerators
- 4/5/6 Hailo-8 AI VPU
- 156 TOPS/35W Power
NEW
x86 Desktop Network Appliances
- Intel Atom C2000 Series
- 1x DDR3 8GB Max
- 4 or 6x RJ45
Fanless Desktop x86 Network Platform for vCPE, SD-WAN and Network Edge
- Intel® Atom™ processor C2358(dual-core), C2518(quad-core) or C2558(quad-core) (Codenamed “Rangeley”)
- Fanless design
- 4 or 6 x GbE RJ-45 LAN ports
- Built-in Intel QuickAssist crypto acceleration
- Intel AES-NI new instructions
- Support up to 8GB DDR3 memory
- Intel i210AT LAN controller
- Support 1 pair Gen.2 LAN Bypass (FW-7525A/C/D)
- Optional rack mounting kit support
x86 Rackmount Network Appliances
- Intel Atom Rangeley
- 1x DDR3 8GB Max
- 4 or 6x RJ45
Rackmount x86 Network Security Platform with Intel® Atom® C2000 Series Processor
- Intel Dual-core Atom C2000 SoC CPU (codenamed "Rangeley")
- Optional rear PCIe expansion slot
- FW-7571A: Built-in 6 GbE LAN ports, FW-7571B:Built-in 4 GbE LAN ports
- Supports Intel QuickAssist Crypto Acceleration
- Supports up to 8 GB ECC DDR3 Memory
- Intel i210AT LAN controller
- 2 system cooling fans
- FW-7571A supports 3rd Generation LAN Bypass function, FW-7571B without LAN Bypass
x86 Rackmount Network Appliances
- Intel Xeon Cascade Lake
- 10x DDR4 320GB Max
- 4x 3.5" HDD, 4x NIC
2U Rackmount Storage Gateway Appliance for Enterprise and Telecom
- 2nd Gen Intel® Xeon® Processor Scalable Family with Intel® C621/C627 Chipset
- 4x 3.5” Swappable HDD, 1x mSATA Onboard Slot
- 10x 288pin, DDR4 2666 MHz REG DIMM, Max. 320GB
- 4x 10G SFP+ or 4x GbE RJ45 (By SKU), 4x NIC Module Slots
- 2x Consoles (RJ45 and Mini USB), 2x USB 3.0
- Intel® QuickAssist Technology (By SKU)
Cloud Storage Platforms
- 2x Intel Xeon Cascade Lake
- 12x 3.5” Drive Bays
- Max. 768GB Memory
NEW
2U High Performance x86 Hyper-converged appliance with 12 x 3.5” Storage Bays
- 2U High Performance Hyper-converged Appliance
- Support Dual 2nd Gen Intel® Xeon® Scalable SP processor family up to 205w and max. up to 24x DDR4 R-DIMM
- Front: 12 x 3.5”HDD SATA 6G (Default) , SAS/2 NVME (Optional)
- Rear: 2 x 2.5” SATA 6G
- Console, LOM port, MGT port, 2x USB 3.0 ports, RJ45, SFP+ ports
- 2x PCI-E*16 FH 10.5”L (Max. 266.7mm) + 1x PCI-E *8 HH/HL
- 1+1 redundant power supply
- A NVIDIA-Certified System for enterprise edge
Modules and Blades
- 6x100G/4x40G/6x10G SFP
- Broadcom Tomahawk
- For HTCA-6000 Series
Modules and Blades
- 1U Height Form Factor
- 6x NVMe SSD Trays
- Hot Swappable
NEW
Modules and Blades
- 20x 10GbE SFP+
- Intel XL710 Controller
- For HTCA-6000 Series
Modules and Blades
- 2xQSFP28+16xSFP+4xRJ45
- Broadcom Trident-III
- For HTCA-6000 Series
Modules and Blades
- 14x QSFP28 Ports
- Intel Tofino Switch
- For HTCA-6600 Series
NEW
Open RAN Platforms
- 10/25/100GbE fiber
- Intel Tofino Switch
- Optional IEEE 1588
NEW
Modules and Blades
- Intel Atom E3800
- Max. 8GB Memory
- HLM1020 Compatible
Modules and Blades
- 2x Intel Xeon Cascade Lake
- Max. 512GB Memory
- 5x Hot Swappable Fans
Compute Blade for HTCA-6000 Series Powered by 2nd Generation Intel® Xeon® Scalable Processors
- Hot swappable x86 compute blade
- Support dual 2nd Generation Intel® Xeon® Scalable Processors (codenamed Skylake-SP/Cascade Lake) C621/C627 PCH
- 16x 288-pin DDR4 DIMMs, max. up to 512GB memory capacity
- 4x KR4 supporting 4x 100G to front Switch blades
- 5x Hot swappable smart fans
Modules and Blades
- 2x 5th Gen Intel Xeon CPU
- Max. 1024GB Memory
- Built-in Intel QAT
PRELIMINARY
PRELIMINARY
Compute Blade for HTCA-6000 Series Powered By The 5th Gen Intel® Xeon® Scalable Processors (Codenamed Emerald Rapids)- Hot swappable x86 compute blade
- 5th Generation Intel® Xeon® Scalable Processors (Codenamed Emerald Rapids) And Emmitsburg PCH
- DDR5 4800 MHz REG DIMM, 16x 288pin DIMM Socket, LRDIMM 1024GB (16 x 64GB) per M/B tray
- Built-in Intel QuickAssist Technology (QAT)
- 4x KR4 supporting 4x 100G to front Switch blades
- 5x Hot swappable smart fans
Open RAN Platforms
- Intel Ice Lake CPU
- 1x PCIe slot
- Support OCP NIC 3.0
NEW
Open RAN Platforms
- Intel Ice Lake CPU
- Double-Width FH3/4L PCIe
- Support OCP NIC 3.0
NEW
2U Compute Sled for HTCA-E400
- Support 3rd Gen Intel Xeon Scalable Processor (codenamed Ice lake)
- Front Access I/O: Storage bays x4, PCIe x1, OCP NIC slot x1, mini-DP port (VGA signal), LOM and USB 3.0 ports
- Support FH3/4L double width or single width PCIe Card
- Support OCP NIC 3.0 Modules
- Compatible with HTCA-E400 Series
HybridTCA Platforms
- 4x Intel Broadwell-EP CPUs
- 2x Switch or 2x Ethernet Blade
- NEBS compliant design
High Availability Chassis 2U Telecom Network Appliance with 2 x86 CPU Blades and 2 I/O Blades
- High availability, full redundancy and extreme high performance
- 2 CPU blades in the rear, per blade supports up to 2 Intel® Xeon® Processor Scalable Family CPUs and 16x DDR4 R-DIMM
- Blade 1~2: Switch fabric blade or ethernet I/O blade
- 2 x Swappable I/O blades in front, supporting up to 2 switch blades or Ethernet blade configuration
- Redundant power supply and removable fan module
- NEBS compliant design
HybridTCA Platforms
- 8x Intel Skylake SP CPUs
- 2x Switch, 1x Storage Blade
- NEBS compliant design
High Availability Chassis 4U Telecom Network Appliance with 4 x86 CPU Blades and 2x Switch blades for redundancy, Storage blades with 10x NVMe SSD or Network blades
- High availability, full redundancy and extreme high performance
- 4 compute blades in the rear, per blade supports up to dual Intel® Xeon® Scalable (Skylake-SP) CPUs and 16x DDR4 R-DIMM
- Upper 2 slots: 2x switch blades in upper two slots for redundancy or 2x Ethernet blades
- Bottom 2 slots: Storage blades with 10x NVMe SSD in bottom two slots or up to 2x Ethernet blades
- Max. up to 80 ports 10G SFP+ Ethernet ports (4x Ethernet blades)
- N+N Redundant power supply and removable fan module
- NEBS compliant design
HybridTCA Platforms
- 12x Intel Emerald Rapids CPU
- 2x Switch, 4x Ethernet Blades
- NEBS compliant design
High Availability Chassis 6U Telecom Network Appliance with 6 x86 CPU Blades and 6 I/O Blades
- High availability, full redundancy and extreme high performance
- 6 CPU blades in the rear, per blade supports up to 2 Intel® Xeon® Processor Scalable Family CPUs and 16x DDR4 R-DIMM
- 6 x Swappable I/O blades on the front, supporting up to 2x Switch blades or 6x Ethernet blades; 6x swappable 3.5” HDD bays
- Blade 1~2: Switch fabric blade or Blade 1~6: Ethernet I/O blade
- NEBS compliant design
- Redundant power supply and removable fan module
HybridTCA Platforms
- 4U Short-Chassis Edge Server
- 5x Intel Ice Lake CPU
- 2x Switch, 5x PCIe Slots
NEW
Carrier-grade Edge Server Chassis for Open RAN / MEC
- Carrier-grade, full redundancy and extreme high performance
- 3rd Generation Intel® Xeon® Scalable Processor with AI Acceleration
- Support 5x 1U compute sleds or 2x 2U+1U compute sleds
- Support 2x 1U switch sleds for redundancy
- Support OCP NIC 3.0 Modules: 2U: Support FH3/4L double width PCIe Card, 1U: Support FHHL PCIe by 16 card
- 450mm Short Depth Chassis for Edge Deployment
- Distinguished, Flexible and Front I/O Access
- 1+1 Redundant Hot-swappable PSU
- NEBS-3 Compliant for Harsh Conditions
Modules and Acceleration Cards
- IPMI 2.0 Compliant
- OPMA Interface
Wide Temperature Network Appliances
- Intel Atom x7-E3950/x5-E3940
- Front access RJ45, SFP, DIO
- 2x SIM, 1x DP, 2x M.2
NEW
Industrial-Grade Cyber Security Appliance with Intel® Atom™ E3900 Processor
- Industrial Grade Cyber Security Platform
- Intel® Atom™ x7-E3950/x5-E3940 (Apollo Lake)
- 8x, 6x or 4x GbE RJ45 ports with 1 or 2 pairs Bypass, SKU C,D,F with 2x GbE SFP
- 2x USB 3.0, 1x DB9 console, 2x DIO, 64GB eMMC onboard
- 1x M.2 B-Key for LTE/5G sub6 with dual SIM, 1x M.2 E-Key for WiFi
- Onboard TPM 2.0
vCPE/uCPE Platforms
- Intel® Atom™ X6000E CPU
- 6x 2.5 GbE RJ45 + 2x SFP
- Optional LTE/Wi-Fi/5G-sub6
NEW
IEC 61850-3 Wide Temperature Industrial Cybersecurity Gateway
- IEC 61850-3 and IEEE 1613 Certified
- Intel® Atom™ X6211E/X6413E/X6425E CPU (formerly Elkhart Lake)
- 6x 100M/1G/2.5 GbE RJ45 with 1 pair bypass, 2x GbE SFP, TPM 2.0, 1x COM, 2x USB, 2x DIO
- Chassis Intrusion Detect, Optional Wi-Fi 6E & IPMI support
- 1x M.2 B-Key w/ dual-Nano SIM For LTE/5G-sub6, 1x M.2 E-Key for Wi-Fi module (By SKU)
- Dual +12~48Vdc Power Input, Operating Temperature -40~70ºC
Wide Temperature Network Appliances
- AMD Ryzen V1404I CPU
- 6x or 4x GbE RJ45 + 2x SFP
- Optional LTE support
NEW
IEC 61850-3 Wide Temperature Industrial Cybersecurity Gateway
- IEC 61850-3 & IEEE 1613 certified
- AMD Ryzen V1404I
- 6x GbE RJ45 or 4x GbE RJ45 + 2x GbE SFP (1 pair LAN bypass by RJ45)
- 1x RJ45 Console, 1x USB 3.0, 2x DIO
- 1x M.2 3042 B-Key for LTE module with dual Nano-SIM
- Dual +12~48VDC Power Input
- Wide Operating Temperature -40~70ºC
Wide Temperature Network Appliances
- Intel Atom x7-E3950
- M-12 LAN and HDMI ports
- 2x M.2, 4x SIM slots
NEW
Fanless Rolling Stock Computer with Intel® Atom™ x7-E3950 Processor
- Intel® Atom™ x7-E3950 Processor
- Certified with EN50155, EN50121, EN50125 and EN45545
- Vehicle/Rail Computer with 6x M12 GbE ports
- 2x M.2 Slots with up to 4x SIM card readers
- Wide range operating temperature from -40 to 70°C
- 2x HDMI and 4x USB ports
- 1x Internal HDD/SSD drive bay
- Support 24~36V or 72~110V power input
Embedded Platform
- Intel® Apollo Lake
- 3x LAN, 2x COM
- 2x DP, 4x DIO
NEW
Industrial Environment Gateway IPC With Intel® Apollo Lake CPU
- Intel® Apollo Lake CPU
- 3x or 2x GbE LAN, 2x RS232/422/485 COM
- 2x USB 3.0 & 2x USB 2.0, 2x Display Ports, 4x DIO
- 1x M.2 3042 B Key For LTE w/ Dual SIM, 1x M.2 2230 E Key For WiFi
- 1x mSATA, 1x 2.5” SATA Drive Bay (Optional)
- 1x DDR3L SODIMM, Max. 8GB
DIN-Rail Industrial Gateway
- Intel® Atom™ X7-E3950
- 4x RJ45 or 2x RJ45+2x SFP
- 2x COM, 2x CAN, 2x M.2
NEW
Robust DIN-rail Fanless Industrial Gateway with LTE/Wi-Fi 6 Connectivity Support
- Intel® Atom™ X7-E3950 / N3350 SoC CPU (formerly Apollo Lake)
- 2x COM, 2x CAN 2.0 (optional for 2x COM), 4x DI/DO, 2x USB 3.0, 1x DB9 console, DP, SKU A/M/O: 4x GbE RJ45 (one pair Bypass), SKU B/N/P: 2x GbE RJ45 (one pair Bypass) & 2x SFP, SKU Q: 4x GbE RJ45
- Onboard eMMC 64GB, DDR3L 4GB pre-install, 1x mSATA, optional 1x internal SATA 2.5” drive bay, TPM 2.0
- 1x M.2 B-Key w/ Nano SIM For LTE, 1x M.2 E-Key For Wi-Fi 5/6
- Wide operating temperature range: -40~70°C for industrial SKU A/B
Intelligent Video Platform
- 11th Gen Intel® Core i CPU
- 6x PoE+, 2x RJ45, 2x COM
- 2x HDMI, 8x DI, 4x DO
NEW
Computing Vision IPC w/ 11th Gen Intel® CoreTM i Series CPU (Codenamed Tiger Lake-UP3)
- 11th Gen Intel® Core i CPU (Up to i7-1185GRE)
- 2x DDR4 2133/2400 SO-DIMM, Max. 64GB
- 6x PoE+, 2x 2.5 Gbps RJ45, 2x COM Ports, 4x USB 3.0
- Intel® Iris® Xe Graphics, 2x HDMI, 8x DI & 4x DO
- 1x M.2 B-Key w/ Nano SIM For 5G, 1x M.2 E-Key For WiFi-6
- 1x M.2 M-Key For PCIe Gen4 x4 NVMe SSD
Deep Learning Inference Appliances
- 11th Gen Intel® Core i CPU
- 1x M.2 B+M Key Hailo-8™
- PoE+, RJ45, COM, DIO
NEW
Computing Vision IPC w/ 11th Gen Intel® Core i Series CPU & Pre-installed M.2 B+M Key Hailo-8™ AI Accelerator
- 11th Gen Intel® CoreTM i CPU (Up to i7-1185GRE)
- Pre-installed 1x M.2 B+M Key Hailo-8™ AI Accelerator
- 2x DDR4 2133/2400 SO-DIMM, Max. 64GB
- 6x PoE+, 2x Ethernet Ports, 2x COM Ports, 4x USB 3.0
- Intel® Iris® Xe Graphics, 2x HDMI, 8x DI & 4x DO
- 1x M.2 B-Key w/ Nano SIM For 5G, 1x M.2 E-Key For WiFi-6
- 1x M.2 M-Key For PCIe Gen4 x4 NVMe SSD
Intelligent Video Platform
- 11th Gen Intel® Core i
- PoE+, COM Ports
- Nano SIM (5G), M.2 (WiFi)
NEW
Computing Vision IPC With 11th Gen Intel® Core i Series CPU
- 11th Gen Intel® Core i CPU (Up to i7-1185GRE)
- 2x DDR4 3200 IBECC SO-DIMM, Max. 64GB
- 4x PoE+, 2x Ethernet Ports, 4x COM Ports, 4x USB 3.0
- Intel® Iris® Xe Graphics, 2x HDMI, 4x DI & 4x DO
- 1x M.2 B-Key w/ Nano SIM For 5G, 1x M.2 E-Key For WiFi, 1x mSATA
vCPE/uCPE Platforms
- Intel Atom Denverton
- 5G & Wi-Fi 6 Ready
- IP67 & Wide Temp.
IP67 Rugged 5G Edge Network Appliance
- Fanless Design Compliant with IP67 and MIL-STD-810G
- Intel® Atom® C3000 Extended Temperature CPU (Denverton)
- 2x DDR4 up to 2133 MHz ECC SODIMM Slots, Default 16GB x1
- M12 I/O: SR-IOV for 4x LAN, 2x PoE+(By SKU), 1x USB, 1x Console
- Wide Operating Temperature: -40~70ºC or -40~60ºC (By SKU)
- 1x M.2 Socket for 5G, 1x M.2 socket for Wi-Fi 6, 1x Mini-SIM
- Intel® QuickAssist Technology
- On-board eMMC 128GB, 1x M.2 2242 B Key, TPM 2.0